We have measured the attenuation of longitudinal acoustic waves in a series of amorphous and nanocrystalline silicon films using picosecond ultrasonics. We determined the attenuation of amorphous Si to be lower than what is predicted by theories based on anharmonic interactions of the ultrasound wave with localized phonons or extended resonant modes. We determined the attenuation of nanocrystalline Si to be nearly one order of magnitude higher than amorphous Si.

We report a method for stress measurement and analysis in silicon oxide thin films using optical interference. Effects of design and fabrication on stress have been studied by fabricating submicron-thick slabs of oxide anchored at one end and extending over a reflective surface. Optical interference occurs between reflections from the surface and the oxide slab, giving rise to light and dark fringes that may be imaged with a microscope. Analysis of the interference pattern at different wavelengths gives the radius of curvature and means of stress mapping. The accuracy exceeds non-interferometric profilometry using optical or confocal microscopes, and it can be more quantitative than scanning electron microscopy. This nondestructive profilometry method can aid the stress optimization of silicon oxide or other transparent thin films to achieve specific mechanical characteristics in MEMS devices.

Optical emission spectroscopy (OES) and Langmuir Probe were used to characterize RF and VHF plasma properties under conditions leading to nanocrystalline silicon film deposition. Films deposited by RF plasma at low pressure (3 Torr), even with high crystalline volume fraction, show weak X-ray diffraction signals, suggesting small grain size, while RF films at higher pressure (8 Torr) and VHF films at both high and low pressure have larger grain sizes. The preferential growth orientation is controlled by the H2/SiH4 ratio with RF plasma, while the film deposited by VHF shows primarily (220) orientation independent of H-dilution ratio. Langmuir Probe measurements indicate that the high energy electron population is reduced by increasing pressure from 3 Torr to 8 Torr in RF plasma. Compared with RF plasma, the VHF plasma shows higher electron density and sheath potential, but lower average electron energy, which may be responsible for the larger grain size and crystal orientation. The growth rate and crystalline volume fraction of the film is correlated with OES intensity ratio of SiH* and Hα/SiH* for both RF and VHF plasmas.

We report on the measurement of defect densities and minority carrier lifetimes in nanocrystalline Si samples contaminated with controlled amounts of oxygen. Two different measurement techniques, a capacitance-frequency (CF) and high temperature capacitance-voltage techniques were used. CF measurement is found to yield noisy defect profiles that could lead to inconclusive results. In this paper, we show an innovative technique to remove the noise and obtain clean data using wavelet transforms. This helps us discover that oxygen is creating both shallow and deep/midgap defect states in lieu with crystalline silicon. Minority carrier lifetime measured using reverse recovery techniques shows excellent inverse correlation between deep defects and minority carrier lifetimes through which hole capture cross section can be evaluated.

An important property of thin film silicon and related materials is the microstructure which may involve the presence of interconnected and isolated voids. We report on effusion measurements of implanted helium (He) to detect such voids. Several series of hydrogenated and unhydrogenated amorphous silicon films prepared by the methods of plasma deposition, hot wire deposition and vacuum evaporation were investigated. The results show common features like a He effusion peak at low temperatures attributed to He out-diffusion through a compact material or through interconnected voids, and a He effusion peak at high temperatures attributed to He trapped in isolated voids. While undoped plasma-grown device-grade hydrogenated amorphous silicon (a-Si:H) films show a rather low concentration of such isolated voids, its concentration can be rather high in doped a-Si:H, in unhydrogenated evaporated material and others.

Noise and electrical conductivity measurements were made at temperatures ranging from approximately 270°K to 320°K on devices fabricated on as grown Boron doped p-type a-Si:H films. The room temperature 1/f noise was found to be proportional to the bias voltage and inversely proportional to the square root of the device area. As a result, the 1/f noise can be described by Hooge’s empirical expression [1]. The 1/f noise was found to be independent of temperature in the range investigated even though the device conductivity changed by a factor of approximately 4 over this range. Conductivity temperature measurements exhibit a T-0.25 dependence, indicative of conduction via localized states in the valence band tail [2,3]. In addition, multiple authors have analyzed hole mobility in a-Si:H and find that the hole mobility depends on the scattering of mobile holes by localized states in the valence band tail [4-7]. We conclude that the a-Si:H carrier concentration does not change appreciably with temperature, and thus, the resistance change in this temperature range is due to the temperature dependence of the hole mobility. Our results are applicable to a basic understanding of noise and conductivity requirements for a-Si:H materials used for microbolometer ambient temperature infrared detection.

Mixed phase thin films consisting of hydrogenated amorphous silicon (a-Si:H) in which germanium nanocrystals (nc-Ge) are embedded have been synthesized using a dual-chamber co-deposition system. Raman spectroscopy and x-ray diffraction measurements confirm the presence of 4 - 4.5 nm diameter nc-Ge homogenously embedded within the a-Si:H matrix. The conductivity and thermopower are studied as the germanium crystal fraction XGe is systematically increased. For XGe < 10%, the thermopower is n-type (as in undoped a-Si:H) while for XGe > 25% p-type transport is observed. For films with 10 < XGe < 25% the thermopower shifts from p-type to n-type as the temperature is increased. This transition is faster than expected from a standard two-channel model for charge transport.

Silicon nanoparticles-based inks were investigated in respect of their suitability for photovoltaic and thermoelectric applications. Nanoparticles with a diameter ranging between 20 to 150 nm were functionalized in order to avoid oxidation as well as having a good stability in suspension. After inkjet-printing and drying, they were annealed up to 1000 °C under nitrogen atmosphere by both rapid thermal and microwave annealing. The influence of the annealing treatment on the structural, electrical, optical and thermal properties was investigated by Raman, SEM, electrical and optical measurements. SEM and Raman demonstrate evolution of the microstructure at temperature as low as 600 °C. Optical, electrical and thermal properties depend strongly on the annealing temperature and tend to exhibit a modification of physical properties above 800 °C when the smallest nanoparticles begin to melt. The annealing method has been identified to be of primary importance on the layer microstructure and its thermal behavior.

It is well established that controlled high-temperature annealing of hydrogen silsesquioxane leads to the formation of small spherical silicon nanocrystals (∼3 nm). The present study outlines an investigation into the influence of annealing time and temperature. After prolonged annealing, crystal surfaces thermodynamically self-optimize to form a variety of faceted structures (e.g., cubic, truncated trigonal and hexagonal structures).

The use of a continuous flow non-thermal plasma reactor for the formation of silicon nanoparticles has attracted great interest because of the advantageous properties of the process [1]. Despite the short residence time in the plasma (around 10 milliseconds), a significant fraction of the precursor, silane, is converted and collected in the form of nanopowder. The structure of the produced powder can be tuned between amorphous and crystalline by adjusting the power of the radio-frequency excitation source, with higher power leading to the formation of crystalline particles. Numerical modeling suggests that higher excitation power results in a higher plasma density, which in turn increases the nanoparticle heating rate due to the interaction between ions, free radicals and the nanopowder suspended in the plasma [2]. While the experimental evidence suggests that plasma heating may be responsible for the formation of crystalline powder, an understanding of the mechanism that leads to the crystallization of the powder while in the plasma is lacking. In this work, we present an experimental investigation on the crystallization kinetic of plasma-produced amorphous powder. Silicon nanoparticles are nucleated and grown using a non-thermal plasma reactor similar to the one described in [1], but operated at low power to give amorphous nanoparticles in a 3-10 nm size range. The particles are then extracted from the reactor using an orifice and aerodynamically dragged into a low pressure reactor placed in a tube furnace capable of reaching temperatures up to 1000°C. Raman and TEM have been used to monitor the crystalline fraction of the material as a function of the residence time and temperature. It is expected that for a residence time in the annealing region of approximately ∼300 milliseconds, a temperature of at least 750 °C is needed to observe the onset of crystallization. A range of crystalline percentages can be observed from 750 °C to 830 °C. A discussion of particle growth and particle interaction, based on experimental evidence, will be presented with its relation to the overall effect on crystallization. Further data analysis allows extrapolating the crystallization rate for the case of this simple, purely thermal system. We conclude that thermal effects alone are not sufficient to explain the formation of crystalline powder in non-thermal plasma reactors.

We have investigated the passivation of low lifetime non-polished Czochralski (CZ) mono-crystalline silicon (c-Si) wafers by hydrogenated amorphous silicon (a-Si:H), deposited by plasma enhanced chemical vapor deposition (PECVD) technique. The dependence of the effective lifetime (τeff) on the deposition parameters including hydrogen gas flow, power and temperature has been studied. Minority carrier lifetime was measured as deposited and also after an annealing step in both quasi-steady-state (QSS) and transient mode of photoconductance decay. By comparison between τeff measured in each of the aforementioned modes, two distinguishable behaviors could be observed. Moreover, to get further insight into the surface passivation mechanism, we have modeled the recombination at a-Si:H/c-Si interface based on the amphoteric nature of dangling bonds. The results of our modeling show that the discrepancy observed between QSS and transient mode is due to the high recombination rate that exists in the bulk of defective CZ wafer and also partly related to the different thicknesses monitored in each mode. So, by comparison between the injection level dependency of τeff measured in QSS and transient modes, we introduce a valuable technique for the evaluation of c-Si bulk lifetime.