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XPS Studies of the Interface Properties of Conductive Adhesive/Eutectic Solder

Published online by Cambridge University Press:  21 February 2011

Y. C. Koo ,
M. C. Jennings ,
R. D. Davidson  and
N. S. McIntyre
Y. C. Koo
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario N6A 5B7 Canada
M. C. Jennings
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario N6A 5B7 Canada
R. D. Davidson
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario N6A 5B7 Canada
N. S. McIntyre
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario N6A 5B7 Canada
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Abstract

The continuing shrinkage of feature size and environmental concerns regarding the use of lead containing solder are major driving forces in the search for alternative technologies for metal interconnects in electronic packaging. Electrically conductive adhesives are considered a potential substitute for the lead-tin solder. This study concentrated on interfacial properties of eutectic solder and silver-filled epoxy adhesives. A freeze fracture technique was employed in order to preserve interfacial information. The chemical composition of the fractured faces varied; the adhesive side was rich in tin, whereas the eutectic solder side showed lead-rich characteristics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 219
Copyright
Copyright © Materials Research Society 1995

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References

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