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The Use of Group V Alkyls as Replacements for Arsine and Phosphine in Hot-Walled VPe Reactors

Published online by Cambridge University Press:  28 February 2011

D. Noel Buckley*
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
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Abstract

The replacement of arsine and phosphine in a hot-walled VPE reactor by Group V alkyls is described. Epitaxial layers of lnP and InGaAs were grown using trimethylarsenic and trimethylphosphorus respectively. The surface morphology obtained was equivalent to that of samples grown using arsine and phosphine. InGaAs samples with no intentional doping were n- type with a background carrier concentration of 6 × 1015 cm−3, about 3 times higher than that of comparison samples grown using arsine. Mobilities measured at 77 K and 300 K respectively were similar to those measured for corresponding samples grown using arsine, suggesting that no significant carbon incorporation occurred. InP was n-type with a background carrier concentration of 3-6 × 1017 cm−3, significantly higher than that of samples grown using phosphine. Preliminary SIMS measurements on the layers suggest that this is due to silicon-based impurities in the trimethylphosphorus. Results reported for MOCVD using arsenic and phosphorus alkyls are contrasted with present results for a hot-walled reactor.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

1.See for example Johnston, W. D. Jr, DiGiuseppe, M. A. and Wilt, D. P., AT&T Technical Journal, January-February 1989.Google Scholar
2. Breckenridge, C., Collins, C., Hollomby, B. and Lulham, G., Society of Toxicology 22nd Annual Meeting, 1983, Abstract No. 93.Google Scholar
3.Application Note No. 1, American Cyanamid Co., Wayne, NJ.Google Scholar
4. Hata, M., Zempo, Y., Fukuhara, N., Swara, K. and Maeda, T., paper E-4 presented at Electronic Materials Conference, Santa Barbara, CA., June 1987; J. Electron. Mater. 16, 8EMC (1987).Google Scholar
5. Lurm, R. M. and Klingert, J. K., App. Phys. Lett., in press (1989).Google Scholar
6."CVD News" - a Morton Thiokol Inc. Newsletter, November 1988.Google Scholar
7. Malish, S. L., private communication.Google Scholar
8.Material Safety Data Sheet No. 3956–02, American Cyanamid Co., Wayne, NJ.Google Scholar
9. Braker, W., Mossman, A. L. and Siegel, D., Effects of Exposure to Toxic Gases - First Aid and Medical Treatment (2nd Edition, Matheson 1977) p. 166.Google Scholar
10. Buckley, D. N. and Matthiesen, M. M. in Advances in Materials Processing and Devices in III-V Compound Semiconductors, edited by Sadana, D. K. and Dupuis, R. D. (Mater. Res. Soc. Proc., Pittsburgh, PA, 1989).Google Scholar
11. Buckley, D. N., J. Electron. Mater. 17, 15 (1988).Google Scholar
12. Blaauw, C., Miner, C., Emmerstorfer, B., SpringThorpe, A. J. and Gallant, M., Can. J. Phys. 63, 664 (1985).Google Scholar
13. Lum, R. M., Klingert, J. K. and Lamont, M. G., Appl. Phys. Lett., 50, 284 (1987).Google Scholar
14. Lum, R. M., Klingert, J. K., Kisker, D. W., Tennant, D. M., Morris, M. D., Maim, D. L., Kovalchic, J., and Heimbrook, L. A., J. Electron Mat. 17, 101 (1988).Google Scholar
15. Bhat, R., Koza, M. A. and Skromme, B. J., Appl. Phys. Lett., 50, 1194 (1987).Google Scholar
16. Ludowise, M. J. and Cooper, C. B., Proc. Soc. Photo-Opt. Instrum. Eng. 323, 117 (1982).Google Scholar
17. Kuo, C. P., Cohen, R. M. and Stringfellow, G. B., J. Cryst. Growth 64, 461 (1983).Google Scholar
18. Moss, R. H. and Evans, J. S., J. Crystal Growth 55, 129 (1981 ).Google Scholar
19. Chen, C. H., Larsen, C. A., Stringfellow, G. B., Brown, D. W. and Robertson, A. J., J. Crystal Growth 77, 11 (1986).Google Scholar
20. Larsen, C. A., Chen, C. H., Kitamura, M., Stringfellow, G. B., Brown, D. W. and Robertson, A. J., Appl. Phys. Lett., 48, 1531 (1986).Google Scholar
21. Ayscough, P. B. and Emeleus, H. J., J. Chem. Soc. 3881 (1954).Google Scholar
22. Price, S. J. W. and Richard, J. P., Can. J. Chem. 48, 3209 (1970).Google Scholar
23. Lee, P. W., Omstead, T. R., McKenna, D. R. and Jensen, K. F., J. Cryst. Growth 85, 165 (1987).Google Scholar
24. Arens, G., Luth, H., Heyen, M. and Balk, P., Thin Solid Films 136, 281 (1986).Google Scholar
25. Karlicek, R. F. Jr, Mitcham, D., Ginocchio, J. C., and Hammarlund, B., J. Electrochem. Soc. 134, 470 (1987) and references therein.Google Scholar