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Underflow Process for Direct-Chip-Attachment Packaging

Published online by Cambridge University Press:  10 February 2011

P. C. Li ,
G. L. Lehmann ,
J. Cascio ,
T. Driscoll ,
Y. J. Huang  and
E. J. Cotts
P. C. Li
Affiliation:
Department of Physics Binghamton University, State University of New York Binghamton, NY 13902-6016
G. L. Lehmann
Affiliation:
Department of Mechanical Engineering, State University of New York Binghamton, NY 13902-6016
J. Cascio
Affiliation:
Department of Physics Binghamton University, State University of New York Binghamton, NY 13902-6016
T. Driscoll
Affiliation:
Department of Physics Binghamton University, State University of New York Binghamton, NY 13902-6016
Y. J. Huang
Affiliation:
Department of Physics Binghamton University, State University of New York Binghamton, NY 13902-6016
E. J. Cotts
Affiliation:
Department of Physics Binghamton University, State University of New York Binghamton, NY 13902-6016
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Abstract

In flip-chip packaging an underfill mixture is placed into the chip-to-substrate standoff created by the array of solder bumps, using a capillary flow process. The flow behavior is a complex function of the mixture properties, the wetting properties, and the flow geometry. This paper reports on the use of a plane channel capillary flow to characterize underfill materials. The measured flow behavior provides evidence that both the contact angle (θ) and the suspension viscosity (μapp) vary with time under the Influence of changing flow conditions. This nonlinear fluid behavior is modeled for the flow of both model suspensions and commercial underfill materials using an extended Washburn model.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 117
Copyright
Copyright © Materials Research Society 1998

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References

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