Hostname: page-component-7479d7b7d-jwnkl Total loading time: 0 Render date: 2024-07-08T15:58:41.253Z Has data issue: false hasContentIssue false
  • English
  • Français

Two-Beam Laser Recrystallization of Silicon on an Insulating Substrate

Published online by Cambridge University Press:  28 February 2011

Samhita Dasgupta ,
Howard E. Jackson  and
Joseph T. Boyd
Samhita Dasgupta
Affiliation:
Department of Physics, University of Cincinnati, Cincinnati, Ohio 45221–0011
Howard E. Jackson
Affiliation:
Solid State Electronics Laboratory, Department of Electrical and Computer Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0030 Department of Physics, University of Cincinnati, Cincinnati, Ohio 45221–0011
Joseph T. Boyd
Affiliation:
Solid State Electronics Laboratory, Department of Electrical and Computer Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0030
Get access

Abstract

Laser recrystallization of silicon on an insulating substrate has been carried out by irradiating polysilicon with both an Ar+ laser operating on all lines in the visible and a CO2 laser operating at 10.6 microns. These experiments were carried out over a variety of laser power densities and substrate temperatures. The use of the two lasers allowed for independent spatial control of temperature in both the polysilicon and the SiO2 layers and helped to reduce the strain at the polysilicon - SiO2 interface. We report the successful recrystallization of polysilicon films without substrate heating for two different silicon-on-insulator structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 53 , 1985 , 71
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Gat, A., Gibbons, J.F., Magee, T.J., Peng, J., Deline, V.R., Williams, P., and Evans, C.A. Jr, Appl. Phys. Lett. 32, 276 (1978).Google Scholar
2.See for instance, Energy Beam-Solid Interactions and Transient Thermal Processing, MRS Symposia Proceedings Vol. 35, edited by Biegelsen, D.K., Rozgonyi, G.A. and Shank, C.V., 984.Google Scholar
3.Leamy, H.J., Laser and Electron Beam Interaction with Solids, edited by Appleton, B.Rf. and Celler, G.K. (Elsevier, New York, 1982), p. 459.Google Scholar
4.Wu, R.W., Boyd, J.T., Timlin, H.A., Jackson, H.E., and Janning, J.L., Appl. Phys. Lett. 46, 498 (1985).Google Scholar
5.Hawkins, W. G., Black, J.G., and Griffiths, C.H., Appl. Phys. Lett. 40, 319 (1982).Google Scholar
6.Boyd, I.W., Binnie, T.D., Wilson, J.I.B., and Colles, M.J., J. Appl. Phys. 55 (8), 3061 (1981).Google Scholar
7.Binnie, T. David, Colles, M.J. and Wilson, J.I.B., Laser Conrolled Chemical Processing of Surfaces, MRS Symposia Proceedings, Vol. 29 edited Ty Johnson, A. Wayne, Ehrlich, D.J. and Schlossberg, H.R., (North Holland, New York, 1984), p. 9.Google Scholar
8.See for instance, Celler, G.K., Trimble, L.E., Ng, K.K., Leamy, H.J., and Baumgart, H., Appl. Phys. Lett. 40, 1043 (1982).Google Scholar
9.Colinge, J.P., Demoulin, E., Bensahel, D., and Auvert, G., Appl. Phys. Lett. 41, 346 (1982).Google Scholar