Article contents
Transgranular Slits in Aluminum Interconnects Caused by Thermal Stress and Electric Current
Published online by Cambridge University Press: 22 February 2011
Abstract
An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1994
References
REFERENCES
- 1
- Cited by