Hostname: page-component-5c6d5d7d68-xq9c7 Total loading time: 0 Render date: 2024-08-16T07:59:03.214Z Has data issue: false hasContentIssue false
  • English
  • Français

Thin Film Ag/YBCO Multistructures for Metal Contact Applications

Published online by Cambridge University Press:  26 February 2011

M. Powers ,
R. Gronsky  and
J. Washburn
M. Powers
Affiliation:
Materials Sciences Division, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, California 94720
R. Gronsky
Affiliation:
Materials Sciences Division, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, California 94720
J. Washburn
Affiliation:
Materials Sciences Division, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, California 94720
Get access

Abstract

A technique is presented where Ag is initially sputter deposited on a single crystal ceramic substrate followed by in situ deposition of YBa2Cu3O7δ The resulting microstructure shows Ag islands amidst a c-axis oriented YBCO film, apparently with intimate contact between the YBCO and substrate. This morphology appears ideal for electrical contact to the {hko} surfaces of the superconductor with current carrying CuO planes in maximum contact with the Ag.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 275: Symposium S – Layered Superconductors: Fabrication, Properties and Applications , 1992 , 825
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Maeno, Y., Kato, M. and Fujita, T.: Jpn. J. Appl. Phys., 26, L329 (1987).Google Scholar
2. Takeuchi, K., Okabe, Y., Kawasaki, M. and Koinuma, H.: Jpn. J. Appl. Phys., 26, L1017 (1987).Google Scholar
3. Caton, R., Selim, R., Buoncrstian, A. M. and Byvik, C. E.: Appl. Phys. Lett., 52, 1014 (1988).Google Scholar
4. Mizushima, K., Sagoi, M., Miura, T. and Yoshida, J.: Appl. Phys. Lett., 52, 1101 (1988).Google Scholar
5. Suzuki, Y., Kusaka, T., Aoki, A., Aoyama, T., Yotsuya, T. and Ogawa, S.: Jpn. J. Appl. Phys., 28 (12), 2463 (1989).Google Scholar
6. Ekin, J., Larson, T., Bergren, N., Nelson, A., Swartzlander, A., Kazmerski, L., Panson, A. and Blankenship, B.: Appl. Phys. Lett., 52 (21), 1819 (1988).Google Scholar
7. Gavaler, J., Braginski, A., Talvacchio, J., Janocko, M., Forrester, M. and Greggi, J., in MRS Vol. EA-14: High-Temperature Superconductors II, Capone, D. II, Butler, W., Batlogg, B. and Chu, C. W., Eds., Pittsburgh, Mater. Res. Co., 1988, pp. 193–196.Google Scholar
8. Maley, M., Willis, J., Katz, J., Castro, R. and Aikin, A.: IEEE Trans. Magn., 25, 2053 (1989).Google Scholar
9. Rubin, H., Rosamilia, J., O'Bryan, H. and Miller, B.: Appl. Phys. Lett., 54 (21), 2151 (1989).Google Scholar
10. Iwata, T., Enomoto, Y., Kubo, S., Moriwaki, K. and Yamaji, A., in Advances in Superconductivity II, Ishiguro, T. and Kajimura, K., Eds., Tokyo, Springer-Verlag, 1989, pp. 773–776.Google Scholar
11. Newman, N., Char, K., Garrison, S., Barton, R., Taber, R., Eom, C., Geballe, T. and Wilkens, B., Appl Phys. Lett., 57(5), 520 (1990).Google Scholar
12. Powers, M., Proceedings of the 12th International Congress for Electron Microscopy, Bailey, G. W., Ed., San Francisco, San Francisco Press, 1990, pp. 66–67.Google Scholar