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Thin Film Adhesion Characterization by Microwedge Scratching of Precracked Fine Lines

Published online by Cambridge University Press:  21 February 2011

M. P. de Boer ,
H. Huang  and
W. W. Gerberich
M. P. de Boer
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
H. Huang
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
W. W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
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Abstract

A new procedure for obtaining accurate work of adhesion values for stiff films as thin as 0.5 µm or less is presented in this paper. The technique is based on fabrication of a two-dimensional test structure using a photolithographic alignment sequence. With precracks of variable length at the end of a fine line, a well known stress state is imposed before delamination. The test structure allows simple analytical equations to be applied to approximate the strain energy release rate, G. Finite element method is used to obtain more accurate values of G as well as of mode mixity. For short crack lengths, no buckling occurs, and the phase angle is near mode II. Kinking into the glass substrate is observed when the measured critical strain energy release rate, Gc, is greater than glass, but not when Gc is less than glass. When the precrack is lengthened, buckling may occur before delamination. In this case the phase angle has a large mode I component, and the crack remains in the interface even in the case of the strong interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 821
Copyright
Copyright © Materials Research Society 1995

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References

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