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Thermophysical Properties of Germanium for Thermal Analysis of Growth from the Melt

Published online by Cambridge University Press:  15 February 2011

Roger K. Crouch ,
A. L. Fripp ,
W. J. Debnam ,
R. E. Taylor  and
H. Groot
Roger K. Crouch
Affiliation:
NASA Langley Research Center, Hampton, Virginia USA
A. L. Fripp
Affiliation:
NASA Langley Research Center, Hampton, Virginia USA
W. J. Debnam
Affiliation:
NASA Langley Research Center, Hampton, Virginia USA
R. E. Taylor
Affiliation:
Thermophysical Properties Research Laboratories, Purdue University, kLafayette, Indiana, USA
H. Groot
Affiliation:
Thermophysical Properties Research Laboratories, Purdue University, kLafayette, Indiana, USA
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Abstract

The thermal diffusivity of Ge has been measured over a temperature range from 300° C to 1010° C which includes values for the melt. Specific heat has been measured from room temperature to 727° C. Thermal conductivity has been calculated over the same temperature range as the diffusivity measurements. These data are reported along with the best values from the literature for the other parameters which are required to calculate the temperature and convective fields for the growth of germanium by the Bridgman method. These parameters include the specific heat, the viscosity, the emissivity, and the density as a function of temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 9 , 1981 , 657
Copyright
Copyright © Materials Research Society 1982

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References

REFERENCES

1.Taylor, R. E., A Description of the Thermophysical Research Laboratory, TPRL 181, (1979).Google Scholar
2.Touloukian, Y. S. et al. , Thermophysical Properties of Matter, 10, Thermal Diffusivity, (IFI/Plenum, New York 1973) p. 69.Google Scholar
3.Sommelet, Pierre and Orr, Raymond, J. Chemical and Engineering Data, 11, 64, (1966).Google Scholar
4.Touloukian, Y. S., ed. Thermophysical Properties of High Temperature Solid Materials, (The Macmillan Company, New York 1967) p. 519.Google Scholar
5.Dismukes, J. P. et al. , Thermoelectric Materials for Power Conversion, Final Report #AO–441794, (David Sarnoff Research Center, Princeton, N. J., 1964).Google Scholar
6.Filippov, L. P., Int. J. Heat Mass Transfer, 16, 865, (1973).Google Scholar
7.Ho, C. Y. et al. , J. Physical and Chemical Reference Data, 3, Suppl. 1, p. 288, (1974).Google Scholar
8.Glazov, V. M. et al. , Soviet Physics-Semiconductors, 5, 182, (1971).Google Scholar
9.Turovskii, B. M. and Ivanova, I. I., Russian J. of Physical Chemistry, 45, (1971).Google Scholar
10.Glazov, V. M. et al. , Liquid Semiconductors, (Plenum Press, New York 1969) pp. 55–83.Google Scholar
11.Brekhovskikh, V. F. in: Progress in Heat Transfer, Konakov, P. K. ed., (Consultants Bureau, New York 1966) pp. 145–150.Google Scholar