Hostname: page-component-8448b6f56d-m8qmq Total loading time: 0 Render date: 2024-04-20T04:23:30.921Z Has data issue: false hasContentIssue false

Thermal Spray Techniques for Fabrication of Meso-Electronics and Sensors

Published online by Cambridge University Press:  10 February 2011

S. Sampath
Affiliation:
Center for Thermal Spray ResearchState University of New York Stony Brook, NY 11794-2275
H. Herman
Affiliation:
Center for Thermal Spray ResearchState University of New York Stony Brook, NY 11794-2275
A. Patel
Affiliation:
Center for Thermal Spray ResearchState University of New York Stony Brook, NY 11794-2275
R. Gambino
Affiliation:
Center for Thermal Spray ResearchState University of New York Stony Brook, NY 11794-2275
R. Greenlaw
Affiliation:
Integrated Coating Solutions Huntington Beach, CA
E. Tormey
Affiliation:
Sarnoff CorporationPrinceton, NJ
Get access

Extract

Thermal Spray is a directed spray process, in which material, generally in molten form, is accelerated to high velocities, impinging upon a substrate, where a dense and strongly adhered deposit is rapidly built. In the case of ceramic deposits, it is necessary to bring the particles to well above the melting point, which is achieved by either a combustion flame or a thermal plasma arc. The deposit microstructure and, thus, properties, aside from being dependent on the spray material, rely on the processing parameters, which are numerous and complex. In recent years, through concerted, integrated efforts of the Center for Thermal Spray Research at the State University of New York at Stony Brook and others, significant fundamental understanding of the process has been achieved, allowing for an enhanced control of the process.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 MRS Bulletin, Guest Editors: Sampath, S. and McCune, R., No.7, 25, 2000, pp. 1253.Google Scholar
2 Fasching, M., Prinz, F. and Weiss, L., J.Thermal Spray Tech., 4(2) (1995) 133.Google Scholar
3 American Welding Society, Thermal Spraying: Practice, Theory, and Application, 1985; Library of Congress No: 84-62707, ISBN 0-87171-246-6Google Scholar
4 Herman, H., Plasma Sprayed Coatings, Scientific American, 256 (1988) 113.Google Scholar
5 Herman, H., MRS Bulletin, No.4, 13, 1988, 60.Google Scholar
6 Gerdeman, D.A. and Hecht, N.L, Arc Plasma Technology in Materials Science, Springer, New York, 1972 Google Scholar
7 Alkhimov, A.P., Papyrin, A.N., Kozarev, V.F., Nesterovich, N.I. and Shushpanov, M.M., U.S. Patent No. 5,302,414 (April 12, 1994)Google Scholar
8 Herman, H., Powders for Thermal Spray Technology, KONA- Powder Science and Tech., No.9 (1991) pp.187199 Google Scholar
9 Sampath, S. and Herman, H., ‘Rapid Solidification and Microstructure Development during Plasma Spray Deposition’, J.Thermal Spray Tech., 5(4) (1996) 445.Google Scholar
10 Herman, H. and Sampath, S., in Metallurgical and Protective Coatings, ed. Stern, K. (Chapman and Hall, NY, 1996) p.261 Google Scholar