Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-05-01T14:45:51.827Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Control of Interfaces for Microelectronic Packaging

Published online by Cambridge University Press:  10 February 2011

E. E. Marotta  and
B. Hana
E. E. Marotta
Affiliation:
M.E. Department, Clemson University, Clemson, S.C. 29672, emarott@ces.clemson.edu
B. Hana
Affiliation:
M.E. Department, Clemson University, Clemson, S.C. 29672, emarott@ces.clemson.edu
Get access

Abstract

The continuous miniaturization of electronic devices places an ever-increasing importance on the thermal management of electronic systems and its subcomponents. The increased power densities and heat generation, due to the miniaturization of the device line features, may lead to higher operating temperatures and greater warpage between the silicon device and its organic carrier. The higher operating temperature may result from the degradation of the overall thermal performance. These additive effects will also lead to an increasing number of thermally induced failures, which will be further magnified when future microelectronic packaging incorporates flip-chip technology.

The higher operating temperatures within microelectronic systems result from inadequate dissipation of the heat generated, while the warpage effect is caused by the mismatch between the thermal coefficients of expansion (ICE) induced by thermal stresses. Often these high temperatures result from the thermal resistance between subcomponents, such as between the contacting surfaces of laminated printed circuit boards, device/epoxy cement and heat spreader (i.e., finned heat sink or heat pipe), and any other metallic or non-metallic interstitial material employed between contacting interfaces.

Published experimental data of potential coatings, adhesives, and elastomeric gaskets is presented that can improve the thermal contact conductance of contacting surfaces within microelectronic systems. In addition, recommendations for future analytical and experimental studies of the mnechanistic principles, which control thermal performance of interstitial materials, are discussed for non-uniform pressure distribution.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 215
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Verma, K., Columbus, D., Han, B. and Chandran, B., Proceedings of 1998 ECTC, Seattle Washington, May (1998).Google Scholar
2. Fried, E. and Kelly, M., AIAA Paper 65–661, Thermophysics Conference, Monterrey, California, Sept. 13–15 (1965).Google Scholar
3. Yovanovich, M. M. and Tuarze, M., Journal of Spacecraft 6 (7), pp. 855–857 (1969).Google Scholar
4. Mal'kov, V. A. and Dobashin, P. A., Inzhenermo-Fizicheskii Zhumal 17 (5), pp. 871–879 (1969).Google Scholar
5. O'Callaghan, P. W., Snaith, B., Probert, S. D., and AI-Astrabadi, F. R., AIAA Paper 81–1166, 16th Thermophysics Conference, Palo Alto, California, June 23–25 (1981).Google Scholar
6. Kang, T. K., Peterson, G. P., and Fletcher, L. S., ASME Transactions, Journal of Heat Transfer 112 (4), pp. 864–871 (1990).Google Scholar
7. Lambert, M. A. and Fletcher, L. S., AIAA Paper 93–0846, 31st Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 11–14 (1993).Google Scholar
8. Mian, M. N., Al-Astrabadi, F. R., O'Callaghan, P. W., and Probert, S. D., Journal of Mechanical Engineering Science 21, pp. 159–166 (1979).Google Scholar
9. Peterson, G. P. and Fletcher, L. S., ASME Transactions, Journal of Heat Transfer 112 (3), pp. 579–585 (1990).Google Scholar
10. Marotta, E. E., Blanchard, D. G., and Fletcher, L. S., AIAA Paper 93–0845, 31st Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 11–14 (1993).Google Scholar
11. Marotta, E. E. and Fletcher, L. S., AIAA Paper 93–2777, 28th Thermophysics Conference, Orlando, Florida, July 6–9 (1993).Google Scholar
12. Ochterbeck, J. M., Fletcher, L. S., and Peterson, G. P., Proceeding of the 9th International Heat transfer Conference 5, Jerusalem, Israel, August 19–22, pp. 445–450 (1990).Google Scholar
13. Scialdone, J. J., Clatterbuck, C. H., and Wall, J. L., AIAA Paper 92–2848, 27th Thermophysics Conference, Nashville, Tennessee, July 6–8 (1992).Google Scholar
14. Fletcher, L. S. and Miller, R. G., Progress in Astronautics and Aeronautics 35, (1974).Google Scholar
15. Mirmira, S. R., Marotta, E. E., and Fletcher, L. S., AIAA Paper 96–1826, 31st Thermophysics Conference, New Orleans, Louisiana, June 17–20 (1996).Google Scholar