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Thermal Conductivity of Carbon Nanotube Composite Films

Published online by Cambridge University Press:  17 March 2011

Quoc Ngo ,
Brett A. Cruden ,
Alan M. Cassell ,
Megan D. Walker ,
Qi Ye ,
Jessica E. Koehne ,
M. Meyyappan ,
Jun Li  and
Cary Y. Yang
Quoc Ngo
Affiliation:
Center for Nanostructures, Santa Clara University, 500 El Camino Real Santa Clara, CA 95050, USA Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Brett A. Cruden
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Alan M. Cassell
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Megan D. Walker
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Qi Ye
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Jessica E. Koehne
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
M. Meyyappan
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Jun Li
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Cary Y. Yang
Affiliation:
Center for Nanostructures, Santa Clara University, 500 El Camino Real Santa Clara, CA 95050, USA
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Abstract

State-of-the-art ICs for microprocessors routinely dissipate power densities on the order of 50 W/cm2. This large power is due to the localized heating of ICs operating at high frequencies, and must be managed for future high-frequency microelectronic applications. Our approach involves finding new and efficient thermally conductive materials. Exploiting carbon nanotube (CNT) films and composites for their superior axial thermal conductance properties has the potential for such an application requiring efficient heat transfer. In this work, we present thermal contact resistance measurement results for CNT and CNT-Cu composite films. It is shown that Cu-filled CNT arrays enhance thermal conductance when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite material provides a mechanically robust alternative to current IC packaging technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F3.18
Copyright
Copyright © Materials Research Society 2004

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