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Thermal Annealing of Vacancy and Interstitial Loops in Ion Irradiated Copper*

Published online by Cambridge University Press:  25 February 2011

B. C. Larson
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
T. S. Noggle
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
J. F. Barhorst
Affiliation:
Emerson Electric Company, St. Charles, Missouri 63301
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Abstract

X-ray diffuse scattering has been used to study the thermal annealing of vacancy and interstitial loops in Ni-ion irradiated copper. The diffuse scattering formalism is reviewed and diffuse scattering measurements are reported on liquid-He temperature Ni-ion irradiated copper after annealing to 40, 275, and 300 °C. Size distributions are presented for vacancy and interstitial loops after each anneal and the thermal-induced changes are discussed in terms of loop dissolution and coalescence.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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Footnotes

*

Research sponsored by the Division of Materials Sciences, U.S. Department of Energy under contract DE-AC05-840R21400 with Martin Marietta Energy Systems,Inc.

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