Hostname: page-component-76fb5796d-9pm4c Total loading time: 0 Render date: 2024-04-26T09:59:09.341Z Has data issue: false hasContentIssue false

Tem Study of Yielding in Polycrystalline Gold Thin Films

Published online by Cambridge University Press:  10 February 2011

Kwame Owusu-Boahen
Affiliation:
Department of Materials Science and Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794–2275, U. S. A.
Alexander H. King
Affiliation:
Department of Materials Science and Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794–2275, U. S. A.
Get access

Abstract

We have used transmission electron microscopy (TEM) to study the microstructure of thin gold films which were grown on 〈100〉 rock salt. The samples were annealed on the rock salt substrate or on a gold TEM specimen grid. Films annealed on rock salt had a larger mean grain size than those annealed on TEM grids. All of the annealed films have a 〈111〉 preferred orientation. Several cracks are observed in the film annealed on rock salt. Plastic yielding of the film was identified by the presence of dislocations, and is caused by tensile stress derived from grain growth. In spite of the uniform texture of the films, the observed dislocations were concentrated only in some individual grains, while their surrounding grains remained dislocation-free. Yielded grains showed no difference of orientation that would lead to higher Schmid factors, so other predictors of yielding must be considered.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Sanchez, J. E. Jr., and Arzt, E., Scripta Metall. and Mater. 27, 285 (1992).Google Scholar
2.Kristensen, N., Ericson, F., Schweitz, J-A., Smith, U., J. Appl. Phys., 69, 2097 (1991).Google Scholar
3.Venkatraman, R. and Bravman, J. C., J. Mater. Res., 7, 2040 (1992).Google Scholar
4.Nix, W. D., Met. Trans. A, 20, 2217 (1989).Google Scholar
5.Thomson, C. V., J. Mater. Res., 8, 237 (1993).Google Scholar
6.Chaudhari, P., J. Vac. Sci. Technol., 9, 521 (1972).Google Scholar
7.Singh, V. V. and King, A. H. and Dixit, G., J. Electr. Mater., 26, 987 (1997).Google Scholar
8.King, A. H., MRS Symp. Ser. (in press).Google Scholar