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Synthesis and Thermoelectric Properties of CeyRuxIr4−xSb12) Filled Skutterudite Compounds

Published online by Cambridge University Press:  01 February 2011

April D. Jewell ,
Jong-Ah Paik  and
Thierry Caillat
April D. Jewell
Affiliation:
ajewell@jpl.nasa.gov, Jet Propulsion Laboratory, 4800 Oak Grove Drive, Mail Stop 277-207, Pasadena, CA, 91109, United States
Jong-Ah Paik
Affiliation:
jong-ah.paik@jpl.nasa.gov
Thierry Caillat
Affiliation:
thierry.caillat@jpl.nasa.gov
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Abstract

Radioisotope Thermoelectric Generators (RTGs) have proved to be reliable, long-lived sources of electrical power that have enabled the conduct of a number of important NASA deep space missions since 1961. Past RTGs have used two types of thermoelectric materials: PbTe/TAGS and SiGe. In an effort to further improve both the thermoelectric efficiency and specific power of the next generation of RTGs, JPL is investigating a number of potential high-efficiency, high-temperature thermoelectric materials that could operate at a hot-side temperature of up to 1275 K. Among the materials being studied are the refractory CeyRu4−xIrxSb12 filled skutterudite compounds. We have synthesized polycrystalline samples for x ≤ 1.5 by a powder metallurgy technique. Dense samples have been hot-pressed from the pre-reacted powders and characterized by a variety of techniques including electron probe microanalysis, differential thermal analysis and thermogravimetic analysis. Seebeck coefficient, electrical resistivity, Hall coefficient, and thermal conductivity measurements have been conducted on the samples from room temperature to 1275 K. Results show that the samples are phase stable up to 1275 K. The results of the transport property measurements are presented and discussed.

Keywords

thermoelectricitydifferential thermal analysis (DTA)electrical properties
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 886: Symposium F – Materials and Technologies fore Direct Thermal-to-Electric Energy Conversion , 2005 , 0886-F09-10
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCE

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