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Superlayer Residual Stress Effect on the Indentation Adhesion Measurements

Published online by Cambridge University Press:  10 February 2011

Alex A. Volinsky ,
Neville R. Moody  and
William W. Gerberich
Alex A. Volinsky
Affiliation:
University of Minnesota, Dept. of Chemical Engineering and Materials Science, Minneapolis, MN 55455, volinsky@cems.umn.edu
Neville R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
William W. Gerberich
Affiliation:
University of Minnesota, Dept. of Chemical Engineering and Materials Science, Minneapolis, MN 55455, volinsky@cems.umn.edu
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Abstract

The practical work of adhesion has been measured in thin aluminum films as a function of film thickness and residual stress. These films were sputter deposited onto thermally oxidized silicon wafers followed by sputter deposition of a one micron thick W superlayer. The superlayer deposition parameters were controlled to produce either a compressive residual stress of 1 GPa or a tensile residual stress of 100 MPa. Nanoindentation testing was then used to induce delamination and a mechanics based model for circular blister formation was used to determine practical works of adhesion. The resulting measured works of adhesion for all films between 100 nm and 1 μm thick was 30 J/m2 regardless of superlayer stress. However, films with the compressively stressed superlayers produced larger blisters than films with tensile stressed superlayers. In addition, these films were susceptible to radial cracking producing a high variability in average adhesion values.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 383
Copyright
Copyright © Materials Research Society 2000

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References

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