Hostname: page-component-848d4c4894-jbqgn Total loading time: 0 Render date: 2024-06-23T08:09:24.817Z Has data issue: false hasContentIssue false

Structure Sensitive Hydrogenation Effects in Polysilicon High Voltage thin Film Transistors

Published online by Cambridge University Press:  15 February 2011

F.J. Clough
Affiliation:
Emerging Technologies Research Centre, Department of Electrical and Electronic Engineering, De Montfort University, Leicester UK, fjclough@dmu.ac.uk.
Y.Z. Xu
Affiliation:
Emerging Technologies Research Centre, Department of Electrical and Electronic Engineering, De Montfort University, Leicester UK, fjclough@dmu.ac.uk.
E.M. Sankara Narayanan
Affiliation:
Emerging Technologies Research Centre, Department of Electrical and Electronic Engineering, De Montfort University, Leicester UK, fjclough@dmu.ac.uk.
R. Cross
Affiliation:
Emerging Technologies Research Centre, Department of Electrical and Electronic Engineering, De Montfort University, Leicester UK, fjclough@dmu.ac.uk.
Get access

Abstract

Hydrogen passivation of grain boundary and in-grain defects is a key process step in the fabrication of high quality poly-Si TFTs. The sensitivity of the hydrogenation process to device geometry is therefore an important consideration. The effects of rf-plasma hydrogenation on the operating performance of a range of self-aligned and offset drain (Loff = 5 to 40 μm) poly-Si TFT configurations is reported. The hydrogenation of offset drain structures results in a predictable increase in the pre-threshold slope and a reduction in the device threshold voltage. However, extended hydrogenation (up to 12 h) can result in a significant reduction in the device drive current (by up to 2 orders). A similar effect is observed in metal field plate HVTFTs in which some portion of the offset region is un-modulated by the additional electrode. The on state conduction in the offset region is examined as a function of hydrogenation time, temperature and planar electric field. The increase in the on resistance is attributed to a reduction in the poly-Si defect density, which moderates carrier transport through the offset region.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Brotherton, S.D., Semiconductor Science & Technology, 10, 721, (1995).Google Scholar
[2] Kamins, T.I. and Marcoux, P.J., IEEE Electron Device Letts., EDL–1, 159, (1980).Google Scholar
[3] Wu, I-W., Lewis, A.G. and Chiang, A., IEEE Electron Device Lett., EDL–10, 123, (1989).Google Scholar
[4] Xu, Y.Z., Clough, F.J., Chen, Y., Narayanan, E.M. Sankara and Milne, W.I., IEEE Electron Device Letts., EDL–20, 80, (1999).Google Scholar
[5] Mitra, U., Rossi, B. and Khan, B., J. Electrochem. Soc., 138, 3420, (1991).Google Scholar
[6] Jackson, W.B., Johnson, N.M. and Smith, D., Appl. Phys. Letts., 61, 1670, (1992).Google Scholar
[7] Choi, K-Y., Yoo, J-S., Han, M-K. and Kim, Y-S., Jpn J. Appl. Phys., 35, 915, (1996).Google Scholar
[8] Unagami, T. and Tsujiyama, B., IEEE Electron Device Letts., 3, 167, (1982).Google Scholar
[9] Seki, S., Kugure, O. and Tsujiyama, B., IEEE Electron Device Letts., 8, 434, (1987).Google Scholar
[10] Fossum, J.G. and Ortiz-Conde, A., IEEE Trans. Electron Devices, 32, 1878, (1985).Google Scholar
[11] Tanaka, K., Arai, H. and Kohda, S., IEEE Electron Device Letts., 9, 23, (1988).Google Scholar
[12] Huang, T-Y., Wu, I-W. and Bruce, R.H., IEEE Electron Device Letts., 11, 244, (1990).Google Scholar
[13] Clough, F.J., Narayanan, E.M. Sankara, Chen, Y., Eccleston, W. and Milne, W.I., Appl. Phys. Letts., 71, 2002, (1997).Google Scholar
[14] Lee, K-Y., Fang, Y-K. and Wuu, S.G., IEEE Electron Device Letts., EDL–18, 187, (1997).Google Scholar
[15] Lamb, D.R., ‘Electrical conduction mechanisms in thin insulating films’, (Methuen & Co. Ltd. 1967).Google Scholar
[16] Saito, Y., Aomori, M. and Kuwano, H., J. Appl. Phys. 81, 754, (1997).Google Scholar