Hostname: page-component-8448b6f56d-42gr6 Total loading time: 0 Render date: 2024-04-18T22:33:32.258Z Has data issue: false hasContentIssue false

Stretchable Dielectric Material for Conformable Bioelectronic Devices

Published online by Cambridge University Press:  01 February 2011

Candice Tsay
Affiliation:
ctsay@princeton.edu, Princeton University, Electrical Engineering, Engineering Quad B405, Princeton University, Olden Street, Princeton, NJ, 08544, United States
Stephanie P. Lacour
Affiliation:
spl37@cam.ac.uk, University of Cambridge, Department of Materials Science, Cambridge, N/A, CB2 3QZ, United Kingdom
Sigurd Wagner
Affiliation:
wagner@princeton.edu, Princeton University, Department of Electrical Engineering, Princeton, NJ, 08544, United States
Zhe Yu
Affiliation:
zy2109@columbia.edu, Columbia University, Department of Biomedical Engineering, New York, NY, 10027, United States
Barclay Morrison III
Affiliation:
bm2119@columbia.edu, Columbia University, Department of Biomedical Engineering, New York, NY, 10027, United States
Get access

Abstract

We use a photo-patternable silicone polymer to fabricate an elastically deformable encapsulation film on stretchable gold lines that electrically conduct while stretched to >50% strain. To detect bioelectrical signals, these stretchable gold lines are patterned as leads and micro-electrodes. They need to be encapsulated with a material that is electrically insulating, as stretchable as the elastomeric substrate, and that can be readily patterned to define recording sites. First, we evaluate the biocompatibility of the elastic encapsulation polymer by assessing the viability of the organotypic hippocampal slices cultured on it. Then, to test the electrical performance of the encapsulation film under large mechanical stress, we measure the dielectric strength of the encapsulation film to 50% tensile strain. Our findings indicate that the photo-patternable silicone material is a suitable interface to in vitro living tissue, and is a reliable stretchable insulator for soft and conformable electronic devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Greenleaf, J.F., Fatemi, M., Insana, M., “Selected methods for imaging elastic properties of biological tissues,” Annu. Rev. Biomed. Eng. vol. 5, pp. 5778, 2003.Google Scholar
2. Morrison, B. III , Cater, H.L., Wang, C. C-B., Thomas, F.C., Hung, C.T., Ateshian, G.A., Sundstrom, L.E., “A tissue level tolerance criterion for living brain developed with an in vitro model of traumatic mechanical loading,” Stapp Car Crash Journal, vol. 47, pp. 93105, 2003.Google Scholar
3. Lacour, S. P., Tsay, C., Wagner, S., Yu, Z., and Morrison, B. III , “Stretchable micro-electrode arrays for dynamic neuronal recording of in vitro mechanically injured brain,” Proc. of the 4th IEEE Conference on Sensors, pp. 617620, 2005.Google Scholar
4. Lacour, S.P., Wagner, S., Huang, Z., Suo, Z., “Stretchable gold conductors on elastomeric substrates,” Appl. Phys. Lett., vol. 82, pp. 24042406, 2003.Google Scholar
5. Lacour, S.P., Wagner, S., “Stretchability of complex patterns of thin metal conductors on elastomeric skin,” Mater. Res. Soc. Symp. Proc. Vol. 854E, pp. U.12.10.1–U.12.10.6, 2004.Google Scholar
6. Zhang, W-Y., Labukas, J.P., Tatic-Lucic, S., Larson, L., Bannuru, T., Vinci, R.P., Ferguson, G.S., “Novel room-temperature first-level packaging process for microscale devices,” Sens. and Actuat. A, vol. 123–124, pp. 646654, 2005.Google Scholar
7. Tsay, C., Lacour, S.P., Wagner, S., Li, T., Suo, Z., “How stretchable can we make thin metal films?Mater. Res. Soc. Symp. Proc. vol. 875, pp. O5.5.1–O5.5.6, 2005.Google Scholar
8. Tsay, C., Lacour, S. P., Wagner, S., and Morrison, B., “Architecture, fabrication and properties of stretchable micro-electrode arrays,” Proc. of the 4th IEEE Conference on Sensors, pp. 11691172, 2005.Google Scholar