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Sputter Deposition of Nanocones for Field Emission

Published online by Cambridge University Press:  10 February 2011

Alan F. Jankowski
Affiliation:
University of California - Lawrence Livermore National Laboratory, P.O. Box 808, Livermore, CA 94550
Jeffrey P. Hayes
Affiliation:
University of California - Lawrence Livermore National Laboratory, P.O. Box 808, Livermore, CA 94550
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Abstract

Deposition into micron-sized holes is known to produce cone shapes as supported on substrates. Potential uses for the cones include field-forming devices as field ionizers and field emission cathodes. The application of such devices include flat panel displays and flash x-ray tubes. Process iterations to closely space arrays of sharp cones have been extensively documented during the past two decades using the physical vapor deposition method of evaporation. Sputter deposition is well known as a method to fill holes and trenches but has only recently been demonstrated as an alternative method to produce field emission cathodes. In a further reduction in size, we have been successful in demonstrating the ability to deposit a cone shape into a cavity with a 300nm diameter hole. Through comparison to the results of electron-beam evaporative deposition, a sputter deposited nanocone appears to be suitable for use as a field emission cathode.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Spindt, C.A., J. Appl. Phys. 39, 3504 (1968).Google Scholar
2. Spindt, C.A., Brodie, I., Humphrey, L. and Westerberg, E.R., J. Appl. Phys. 47, 5248 (1976).Google Scholar
3. Bozler, C.O., Harris, C.T., Rabe, S., Rathman, D.D., Holis, M.A. and Smith, H.I., J. Vac. Sci. Technol. B12, 629 (1974).Google Scholar
4. Jankowski, A.F. and Hayes, J.P., “Sputter Deposition of a Field Emission Cathode”, DOE Patent Docket No. S-81642 (RIL-12765), LLNL Docket No. IL-9535 (1994).Google Scholar
5. van Veen, G.N.A., Theunissen, B., van de Heuvel, K., Horne, R. and Burgmans, A.L.J., J. Vac. Sci. Technol. B 13, 478 (1995), see also European Patent Application No. 93200841.0 (1993).Google Scholar
6. Fowler, R.H. and Nordheim, L.W., Proc. R. Soc. London A 119, 173 (1928).Google Scholar
7. Lo, W.K., Parthasarathy, G., Lo, C.W., Tanenbaum, D.M., Craighead, H.G. and Isaacson, M.S., J. Vac. Sci. Technol. B 14, 3787 (1996).Google Scholar
8. Mackie, W.A., Hartman, R.L., Anderson, M.A. and Davis, P.R., J. Vac. Sci. Technol. B 12, 722 (1994).Google Scholar