Hostname: page-component-848d4c4894-8bljj Total loading time: 0 Render date: 2024-06-20T05:17:11.600Z Has data issue: false hasContentIssue false

Simultaneous Measurements of Electrical Resistivity and Raman Scattering from Conductive Die Attach Adhesives

Published online by Cambridge University Press:  21 March 2011

Joseph Miragliotta
Affiliation:
The Johns Hopkins University Applied Physics Laboratory Laurel, MD 20723-6099, USA
Richard C. Benson
Affiliation:
The Johns Hopkins University Applied Physics Laboratory Laurel, MD 20723-6099, USA
Terry E. Phillips
Affiliation:
The Johns Hopkins University Applied Physics Laboratory Laurel, MD 20723-6099, USA
John A. Emerson
Affiliation:
Sandia National Laboratories, Albuquerque, NM Department 1472, MS 0958 Albuquerque, NM 87185-0958, USA
Get access

Abstract

The development of electrical conductivity in silver (Ag)-filled conductive polymer adhesives is dependent on the thermal profile of the curing process. Previous studies of polymer adhesive systems have shown that chemical reactions at the interface of the micronsized Ag filler are a key factor in determining the subsequent performance of the conductive system. In an attempt to correlate the behavior of electrical conductivity with the chemical nature of the Ag particle interface, we have simultaneously performed electrical resistivity and surface enhanced Raman scattering (SERS) measurements on a commercial conductive adhesive. At room temperature in the low conductance state (∼10−9 ohms−1), the SERS spectrum from the uncured adhesive exhibited peaks that were identified with a molecular species bound to Ag surface via the carboxylate functionality of the adsorbate. During the thermal cure processing, the SERS data showed a partial decomposition of the carboxylate species and the formation of an amorphous carbon layer at the Ag surface. A comparison of the simultaneously recorded electrical resistance and SERS data showed a strong correlation between the development of high conductance (∼ 1 ohm−1) in the adhesive and the formation of the amorphous carbon layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nguyen, G., Williams, J., Gibson, F., and Winster, T., “Electrical reliability of conductive adhesives for surface mount applications,” Proc. Int. Electron. Packag. Conf., 1993, pp. 479486.Google Scholar
2. Markley, D. L., Tong, Q. K., Magliocca, D. J., and Hahn, T. D., “Characterization of silver flakes utilized for isotropic conducive adhesives,” Proc. Int. Symp. Adv. Packag. Mater., pp. 1620 (1999).Google Scholar
3. Lu, D. and Wong, C. P., “Effects of shrinkage on conductivity of isotropic conductive adhesives,” Proc. Int. Symp. Adv. Packag. Mater., pp. 295301 (1999).Google Scholar
4. Lu, D., Tong, Q. K., and Wong, C. P., “Conductivity mechanisms of isotropic conductive adhesives,” IEEE Trans. Electron. Packag. Manufact. 22, 223 (1999).Google Scholar
5. Surface Enhanced Raman Scattering, edited by Chang, R. K and Furtak, T. E.,(Plenum, New York, 1982).Google Scholar
6. Miragliotta, J., Benson, R. C., and Phillips, T. E., MRS Symposium Proceeding vol. 445, edited by Groothuis, S. K., Ho, P. S., Ishida, K., and Wu, T., (Materials Research Society, Pittsburgh, PA, 1997), pg. 217.Google Scholar
7. Miragliotta, J., Benson, R. C., Phillips, T. E., and Emerson, J. A., MRS Symposium Proceeding vol. 515, edited by Belton, D. J., Gaynes, M., Jacobs, E. G., Pearson, R., and Wu, T., (Materials Research Society, Pittsburgh, PA, 1997), pg. 245.Google Scholar
8. Opila, R. L. and Worlock, J. M., J. Electrochem. Soc. 133 (1986) 974.Google Scholar
9. Hudson, M. and Waters, D. N., “Surface-enhanced Raman scattering at a flake silver surface,” Spectrochim. Acta 47A, 1467 (1991).Google Scholar
10. Sexton, B. and Madix, R. J., Surf. Sci. 105 (1981) 177.Google Scholar
11. Lee, E. H., Hembree, D. M. Jr., Rao, G. R., and Mansur, L. K., Phys. Rev. B48 (1993) 15540.Google Scholar