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Simulation of 3D Films Deposited by Glancing Angle Deposition Using 3D-Films

Published online by Cambridge University Press:  10 February 2011

T. Smy
Affiliation:
Department of Electronics, Carleton University, Ottawa, ON, Canada KIS 5B6, tjs@doe.carleton.ca
D. Vick
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
M. J. Brett
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
S. K. Dew
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
A. T. Wu
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
J.C. Sit
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
K. D. Harris
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta Edmonton, AB, Canada T6G 2G7
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Abstract

A new fully three dimensional (3D) ballistic deposition simulator 3D-FILMS has been developed for the modeling of thin film deposition and structure. The simulator may be implemented using the memory resources available to workstations. In order to illustrate the capabilities of 3D-FILMS, we apply it to the growth of engineered porous thin films produced by the technique of GLancing Angle Deposition (GLAD).

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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