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Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines
Published online by Cambridge University Press: 10 February 2011
Abstract
A simple computer model is proposed to simulate the microstructural evolution of Al-4wt%Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.
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- Copyright © Materials Research Society 1997