Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-23T11:08:38.078Z Has data issue: false hasContentIssue false

Si Ion Implantation in InAlAs/InGaAs Heterostructures

Published online by Cambridge University Press:  21 February 2011

B. Descouts
Affiliation:
Centre National d'Etudes des Télécommunications Laboratoire de Bagneux 196 avenue Henri Ravera -92220 BAGNEUX - FRANCE
N. Duhamel
Affiliation:
Centre National d'Etudes des Télécommunications route de Trégastel -22301 LANNION Cedex
E. V. K. Rao
Affiliation:
Centre National d'Etudes des Télécommunications Laboratoire de Bagneux 196 avenue Henri Ravera -92220 BAGNEUX - FRANCE
Y. Gao
Affiliation:
Centre National d'Etudes des Télécommunications Laboratoire de Bagneux 196 avenue Henri Ravera -92220 BAGNEUX - FRANCE
J. P. Praseuth
Affiliation:
Centre National d'Etudes des Télécommunications Laboratoire de Bagneux 196 avenue Henri Ravera -92220 BAGNEUX - FRANCE
Get access

Abstract

Si29 implants have been performed in InGaAs and InAlAs single layers as well as in InGaAs/InAlAs heterostructures. Nearly 100% activation has been obtained in InGaAs after conventional furnace annealing or rapid thermal annealing. On the other hand, a low activation efficiency (30%) has been observed in InAlAs. A preliminary photoluminescence measurements study shows that an appreciable fraction of Si exists in the form of complex centers. Hall effect and specific contact resistivity maps carried out in the heterostructures indicate a very good homogeneity of the electrical parameters over a 4 cm2 sample and give a satisfactory value of the specific contact resistivity (10−7 ω.cm2)

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Giraudet, L., Nguyen, N.L., Allovon, M., Laporte, M., Scavennec, A., presented at the 12th workshoo on compound semiconductor devices and integrated circuits, Lugano, Zwitzerland (1988)Google Scholar
2. Chen, C.Y., Cho, A.Y., Alavi, K., Garbinski, P.A., IEEE Electron Device Lett., EDL-3(8), 205 (1982)Google Scholar
3. Pearsall, T.P., Hendel, R., O'Connor, P., Alavi, K., Cho, A.Y., IEEE Electron Device Lett., EL-4(1), 5 (1983)Google Scholar
4. Chen, C.Y., Cho, A.Y., Cheng, K.Y., Pearsall, J.P., O'Connor, P., Garbinski, P.A., IEEE Electron Device Lett, EDL-3(6), 152 (1982)Google Scholar
5. Lee, W., Fonstad, C.G., IEEE Electron Device Lett., EDL-7(12), 683 (1986)Google Scholar
6. Tsang, W.T., J. Appl. Phys., 52(6), 3861 (1981)Google Scholar
7. Choudhury, A.N.M.M., Slater, N.J., Tabatabaie-Alavie, K., Fonstad, C.G., Appl. Phys. Lett., 40(7), 607 (1982)Google Scholar
8. Penna, T., Tell, B., Liao, A.S.H., Bridges, J.J., Burkhardt, G., J. Appl. Phys., 51(2), 351 (1985)Google Scholar
9. Praseuth, J.P., Joncour, M.C., Gerard, J.M., Henoc, P., Quillec, M., J. Appl. Phy., 63(2),400 (1988)Google Scholar
10. Praseuth, J.P., Goldstein, L., Henoc, P., Primot, J., Danan, G., J.Appl.Phy., 61(1), 215 (1987)Google Scholar
11. Duhamel, N., Descouts, B., Krauz, P., Rao, E.V.K., Dangla, J., Henoc, P. in Ranid Thermal Processing of Electronic Materials, edited by Wilson, S.R., Powell, R., Davies, D.E., (Mater. Res. Soc. Proc. 92, Pittsburgh, PA 1987) pp.443448 Google Scholar
12. Halogen lamps furnace from SITESA-ADDAX, MONTBONNOT (FRANCE)Google Scholar
13. Cheng, K.Y., Cho, A.Y., J.Appl.Phys., 51(6),4411 (1982)Google Scholar
14. Lam, C.S., Fonstad, C.G., J.Appl.Phys.,64(4),2103(1988)Google Scholar
15. Duhamel, N., Rao, E.V.K., Gauneau, M., Thibierge, H., Mircea, A., J.Cryst.Growth,64 186(1983)Google Scholar