Hostname: page-component-848d4c4894-jbqgn Total loading time: 0 Render date: 2024-07-04T10:44:21.909Z Has data issue: false hasContentIssue false

Short Time annealing of As and B Ion Implanted Si using Tungsten-Halogen Lamps

Published online by Cambridge University Press:  22 February 2011

T. O. Sedgwick
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598;
R. Kalish
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598;
S. R. Mader
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598;
S. C. Shatas
Affiliation:
A. G. Associates, Palo Alto, CA 94303
Get access

Abstract

B and As implanted Si wafers have been thermally annealed by an array of tungsten halogen lamps at 1000–1200°C for 1–10 sec. Annealing above 1100°C leaves the crystal free of extended defects in all cases as determined by TEM. An enhanced diffusion is observed above normal values characterized by a low activation energy for both As and B samples. This enhanced diffusion is transient and occurs within about one second since the RBS and SIMS dopant profiles are identical for 1 sec and a 10 sec anneal.

Type
Research Article
Copyright
Copyright © Materials Research Society 1984

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Sedgwick, T.O., J. Electrochem. Soc. 130, 484 (1983).Google Scholar
2.Benton, J.L., Celler, G.K., Jacobson, D.C., Kimerling, L.C., Lischner, D.J., Miller, G.L. and Robinson, McD. in “Laser and Electron Beam Interactions with Solids,” Appelton, B.R. and Celler, G.K., Editors, Vol. 4, p 765. Proceedings of the 1981 Materials Research Soc. Conf. in Boston, Elsevier, North-Holland (1982).Google Scholar
3.Shatas, S.C. and Gat, A., Abstract B-2 presented at the Electronic Materials Conf.June 23–25, 1982Fort Collins, Colorado.Google Scholar
4.Hodgson, RT., Baglin, J.E.E., Michel, A.E., Mader, S. and Gelpey, J.C., “Laser and Solid Interactions and Transient Thermal Processing of Materials, Narayan, J., Brown, W.L., and Lemons, R.A., Editors, Proceeding of the 1982 Materials Research Soc. Conf. in Boston, Vol. 13, (North-Holland, New York, 1983), p 355.Google Scholar
5.Nishiyama, K., Kuroda, Z., Miyaaji, F., Tamijima, K., Kato, K., Hayashi, H. and Tanabe, K., Presented at the 21st Symposium on Semiconductors and Integrated Circuits Technology, December 3–4, 1981, Electrochemical Soc. of Japan, Paper No. 7.Google Scholar
6.Fulks, R.T., Russo, C.J., Hanley, P.R. an Kamins, T.I., Appl. Phys. Lett. 39, 604 (1981).Google Scholar
7.Kugimiya, K. and Fuse, G., Jap. J. of Appl. Phys. 21, L16L18, (1982).Google Scholar
8.Seidel, T.E., IEEE Device Letters, EDL-4 353, (1983).Google Scholar
9.Kalish, R., Sedgwick, T.O., Mader, S. and Shatas, S.C., to appear in Appl. Phys. Letters, January 1984.Google Scholar
10.Sadana, D.K., Shatas, S.C. and Gat, A., Proc. of Microscopy of Semiconducting Materials, Inst. of Phys. London, 1983 (in press).Google Scholar
11.Hofker, W.K., Philips Res. Rep. Suppl. 69, (1975).Google Scholar
12.Itoh, T. and Ohdomari, I., J. Appl. Phys. 41, 434 (1970).Google Scholar
13.Seidel, T.E. and MacRae, A.U., Trans. of the Metallurgical Soc. of AIME 245, 491 (1969).Google Scholar
14.Fair, R.B. and Tsai, J.C.C., J. Electrochem. Soc. 122, 1689 (1975).Google Scholar
1.Morehead, F., private communicationGoogle Scholar
16.Masters, B.J. and Gorey, E.F., J. Appl. Phys. 49, 2717 (1978)Google Scholar
17.Hu, S.M. and Schmidt, S., J. Appl. Phys. 39, 4272 (1968).Google Scholar