Hostname: page-component-848d4c4894-xfwgj Total loading time: 0 Render date: 2024-06-19T19:08:09.175Z Has data issue: false hasContentIssue false

Role of Vacancies and Solute Atoms on Grain Boundary Sliding

Published online by Cambridge University Press:  10 February 2011

J.S. Vetrano
Affiliation:
Pacific Northwest National Laboratory, Richland, WA 99352, john.vetrano@pnl.gov
C.H. Henager Jr.
Affiliation:
Pacific Northwest National Laboratory, Richland, WA 99352, john.vetrano@pnl.gov
E.P. Simonen
Affiliation:
Pacific Northwest National Laboratory, Richland, WA 99352, john.vetrano@pnl.gov
Get access

Abstract

It is necessary for grain boundary dislocations to slide and climb during the grain boundary sliding process that dominates fine-grained superplastic deformation. The process of climb requires either an influx of vacancies to the grain boundary plane or a local generation of vacancies. Transmission electron microscopy (TEM) observations of grain boundaries in superplastically deformed Al-Mg-Mn alloys quenched under load from the deformation temperature have revealed the presence of nano-scale cavities resulting from a localized supersaturation of vacancies at the grain boundary. Compositional measurements along interfaces have also shown an effect of solute atoms on the local structure. This is shown to result from a coupling of vacancy and solute atom flows during deformation and quenching. Calculations of the localized vacancy concentration indicate that the supersaturation along the grain boundary can be as much as a factor often. The effects of the local supersaturation and solute atom movement on deformation rates and cavity nucleation and growth will be discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sherby, O. and Wadsworth, J., Progress in Materials Science, 33, 169 (1989).10.1016/0079-6425(89)90004-2Google Scholar
2. Valiev, R.Z. and Langdon, T.G., Acta metall. mater., 41, 949 (1993).10.1016/0956-7151(93)90029-RGoogle Scholar
3. Langdon, T.G., Acta metall. mater., 42, 2437 (1994).10.1016/0956-7151(94)90322-0Google Scholar
4. Chokshi, A.H. and Mukherjee, A.K., Acta metall., 37, 3007 (1989).10.1016/0001-6160(89)90337-4Google Scholar
5. Shin, D.H. and Park, K.-T., Mat. Sci and Engineering, A 268, 55 (1999).10.1016/S0921-5093(99)00116-1Google Scholar
6. Vetrano, J.S., Henager, C.H. Jr., Smith, M.T. and Bruemmer, S.M. in Hot Deformation of Aluminum Alloys II, (TMS, Warrendale, PA 1998) p. 407.Google Scholar
7. Smith, D.A., Ultramicroscopy, 29, 1 (1989).10.1016/0304-3991(89)90225-8Google Scholar
8. Lojkowski, W., Wyrzykowski, J.W., Kwiecinski, J., Beke, D.L. and Godeny, I., Defect and Diffusion Forum, 66–69, 701 (1989).Google Scholar
9. Pond, R.C., Serra, A. and Bacon, D.J., Acta mater., 47, 1441 (1999).10.1016/S1359-6454(99)00017-8Google Scholar
1 O. Vetrano, J.S., Simonen, E.P. and Bruemmer, S.M., Mat. Science Forum, 243–245, 493 (1997).Google Scholar
11. Vetrano, J.S., Simonen, E.P. and Bruemmer, S.M., Acta mater., in press.Google Scholar
12. Strangwood, M., Hippsley, C.A. and Lewandowski, J.J., Scripta Met. et Mat., 24, 1483 (1990).10.1016/0956-716X(90)90418-GGoogle Scholar
13. Mabuchi, M. and Higashi, K., Acta mater., 47, 1915 (1999).10.1016/S1359-6454(99)00045-2Google Scholar
14. Park, K.-T., Yang, S.T., Earthman, J.C. and Mohamed, F.A., Mat. Sci, and Engineering, A 188, 59 (1994).10.1016/0921-5093(94)90356-5Google Scholar
15. Ge, Y., Master's Thesis, Washington State University (1997).Google Scholar
16. Henager, C.H. Jr., Vetrano, J.S., Gertsman, V. and Bruemmer, S.M., This proceedings.Google Scholar
17. Liu, X.-Y. and Adams, J.B., Acta mater., 46, 3467 (1998).10.1016/S1359-6454(98)00038-XGoogle Scholar
18. Hosakawa, H., Iwasaki, H., Mori, T., Mabuchi, M., Tagata, T. and Higashi, K., Acta mater., 47, 1859 (1999).10.1016/S1359-6454(99)00047-6Google Scholar