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The Role of Nanoparticle Inclusions on High-performance half-Heusler Thermoelectric Materials

Published online by Cambridge University Press:  01 February 2011

Rumana Yaqub ,
Paranti Sahoo Sahoo ,
Julien Pierre Makongo ,
Westly M Notling ,
Pierre F. P. Poudeu  and
Kevin L. Stokes
Rumana Yaqub
Affiliation:
ryaqub@uno.edu, Advanced Material Research Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Paranti Sahoo Sahoo
Affiliation:
pshoo@uno.edu, Advanced Material Research Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Julien Pierre Makongo
Affiliation:
jmkongo@uno.edu, Advanced Material Reserch Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Westly M Notling
Affiliation:
kazkek@gmail.com, Advanced Material Research Institute, Univeristy of New Orealns, New Orleans, Louisiana, United States
Pierre F. P. Poudeu
Affiliation:
ppoudeup@uno.edu, University of New Orleans, Chemistry, 2000 Lakeshore Dr, SC2005, New Orleans, Louisiana, 70148, United States, (504)2801057, (504)2803185
Kevin L. Stokes
Affiliation:
klstokes@uno.edu, University of New Orleans, Physics, New Orleans, Louisiana, United States
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Abstract

We report the effect of adding NiO nanoparticles on the transport properties of the half-Heusler alloys Zr0.5Hf0.5Ni1-xPdxSn0.99Sb0.01 (x=0, and 0.2). The half-Heusler matrix materials are prepared by traditional powder metallurgy methods. The resulting bulk matrix is mixed with different volume fractions of nanometer-sized NiO particles, previously synthesized by solution-phase chemical methods. The resulting mixture is densified under uniaxial pressure to form a composite. The resulting material is found to contain both half-Heusler and full-Heusler phases. The corresponding compounds have higher thermal conductivity and electron mobility.

Keywords

thermal conductivityHall effectalloy
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1267: Symposium DD – Thermoelectric Materials 2010-Growth, Properties, Novel Characterization Methods and Applications , 2010 , 1267-DD05-18
Copyright
Copyright © Materials Research Society 2010

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References

1 Ioffe, A.F., Semiconductor Thermoelements and Thermoelectric Cooling, Inforearch Ltd (1957)Google Scholar
2 Huang, X.Y Solid State Communications, 130, (2004).Google Scholar
3 Chen, L.D, Huang, X.Y Journal of Applied Physics 99, 64305 (2006)Google Scholar
4 Hasselman, D.P.H. and Johnson, L.F., J. Comp.Mater. 21, 508 (1998)Google Scholar
5 Benvensite, Y., J .Appl.Phys. 61 2840 (1987)Google Scholar