Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-06-16T17:24:06.191Z Has data issue: false hasContentIssue false
  • English
  • Français

Role of Kinetic Energy of Sputtered Particles in Thin Film Properties

Published online by Cambridge University Press:  25 February 2011

Yasunori Taga
Yasunori Taga*
Affiliation:
TOYOTA Central Research and Development Laboratories, Inc., Nagakute, Aichi 480-11, Japan
Get access

Abstract

The thin film processes of the sputter deposition method have been reviewed with special emphasis on the effects of kinetic energy of sputtered particles and ion bombardment during deposition on thin film properties. An overview is first given to describe the thin film process and ion-surface interactions, where the methods of measuring the energy distribution of sputtered ions and the anisotropic-emission-effect sputter deposition are presented. Experimental results for Cr, SiO2 and Ni-Si-B films are presented, and the correlation between the structure and properties of the thin films is discussed. Research in modification of thin films by energetic atoms and ions is an exciting area of materials science in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 268: Symposium K – Materials Modification by Energetic Atoms and Ions , 1992 , 95
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Sigmund, P., Phys. Rev. 184, 383 (1969).CrossRefGoogle Scholar
[2] Pivin, J. C., J. Mater Sci. 18, 1267 (1983).CrossRefGoogle Scholar
[3] Martin, P. J., J. Mater. Sci. 21, 1 (1986).CrossRefGoogle Scholar
[4] Taga, Y., Proceedings SPIE 1275, 110 (1990).CrossRefGoogle Scholar
[5] Kaminsky, M., Atolmic and Ionic Impact on Metal Surfaces (Springer-Verlag, Berlin, 1965).CrossRefGoogle Scholar
[6] Carter, G. and Colligon, J. S., Ion Bombardment of Solids (Elsevier, New York, 1988).Google Scholar
[7] Berisch, R., Sputtering by Particle Bombardment, Topics in Applied Physics, Vol.52, edited by Berisch, R. (Springer-Verlag, Berlin, 1983).CrossRefGoogle Scholar
[8] Andersen, H. H. and Bay, H. L., ibid. p.145.Google Scholar
[9] Coburn, J. W., Thin Solid Films 64, 371 (1979).CrossRefGoogle Scholar
[10] Stuart, R. V. and Wehner, G. K., J. Appl. Phys. 35, 1819 (1964).CrossRefGoogle Scholar
[11] Kleinsasser, A. W. and Buhrman, R. A., Appl. Phys. Lett. 37, 841 (1980).CrossRefGoogle Scholar
[12] Olson, R. R. and Wehner, G. K., J. Vac. Sci. Technol. 14, 319 (1977)CrossRefGoogle Scholar
[13] Hoffman, D. W. and Thornton, J. A, Thin Solid Films 40, 355 (1977).CrossRefGoogle Scholar
[14] , Indem, J. Vac. Sci. Technol. 16, 134 (1979).CrossRefGoogle Scholar
[15] Kageyama, Y. and Taga, Y., Appl. Phys. Lett. 55, 1035 (1989).CrossRefGoogle Scholar
[16] Ohwaki, T. and Taga, Y., Jap. J. Appl. Phys. 23, 1466 (1984).CrossRefGoogle Scholar
[17] Thompson, M. W., Philos. Mag. 18, 377 (1968).CrossRefGoogle Scholar
[18] Roth, J., T. Appl. Phy. 52, 91 (1983).CrossRefGoogle Scholar
[19] Saidoh, M., Gnaser, H. and Hofer, W. O., Appl. Phys. A40, 197 (1986).CrossRefGoogle Scholar
[20] Sze, S. M., J. Appl. Phys. 38, 2951 (1967).CrossRefGoogle Scholar
[21] Vossen, J. L. and Kern, W., Thin Film Processes (Academic Press, New York, 1978).Google Scholar
[22] Chapman, B. N., Glow Discharge Process (Wiley, New York, 1980).Google Scholar
[23] Sawada, Y. and Taga, Y., Thin Solid Films, 110, L129, (1983).CrossRefGoogle Scholar
[24] Westwood, W. D., Thin Film Physics, Vol.14, edited by Francombe, N. H. and Vossen, J. L. (Academic Press, New York, 1989).Google Scholar
[25] Rossnagel, S. M., J. Vac. Sci. Technol. A7, 1025 (1989).CrossRefGoogle Scholar
[26] Ohwaki, T. and Taga, Y., Appl. Phys. Lett. 55, 837 (1989).CrossRefGoogle Scholar
[27] Gotoh, Y. and Taga, Y., J. Appl. Phys. 67, 1030 (1990).CrossRefGoogle Scholar
[28] Yamada, T., Tani, N., Ishikawa, M., Ota, Y., Nakamura, K. and Itoh, A., ibid. MAG–21, 1429 (1985).Google Scholar
[29] Chen, G. L., IEEE Trans. Magn. MAG–22, 234 (1986).Google Scholar
[30] Wehner, G. K. and Rosenberg, D., J. Appl. Phys. 31, 177 (1960).CrossRefGoogle Scholar
[31] Yurasova, V. E., Shulga, V. I. and Kaapuzov, D. S., Can. J. Phys. 46, 759 (1968).CrossRefGoogle Scholar
[32] Thornton, J. A., Tabock, J. and Hoffman, D. W., Thin Solid Films 64, 111 (1979).CrossRefGoogle Scholar