Hostname: page-component-76fb5796d-22dnz Total loading time: 0 Render date: 2024-04-26T02:52:46.723Z Has data issue: false hasContentIssue false
  • English
  • Français

A Review of Tension Test Methods for Thin Films

Published online by Cambridge University Press:  01 February 2011

William N. Sharpe Jr.
William N. Sharpe Jr.*
Affiliation:
sharpe@jhu.edu, Johns Hopkins University, Mechanical Engineering, 3400 North Charles Street, Baltimore, MD, 21218, United States
Get access

Abstract

Test methods for mechanical property measurement of the thin films used in MEMS have been developed and refined over the last decade. This brief review considers only tensile testing since that is the preferred method for measuring Young's modulus, strength, etc. for macroscale structural materials. There are basically two kinds of tensile specimens – framed specimens whose support strips are cut after mounting and semidetached specimens fastened to the substrate at one end. The loading and force measurement systems are similar and use commercial transducers. Strain is measured either by overall grip displacement or by digital imaging in most cases. Initial works are described and followed by descriptions of some recent applications. The paper concludes with a suggested test method that could be amenable to standardization.

Keywords

thin filmelastic propertiesstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD01-01
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Sharpe, W. N Jr. in Materials Science of Microelectromechanical Systems (MEMS) Devices IV, (Mater. Res. Soc. 687, Boston, MA, 2002) pp. 293–304.Google Scholar
2 Sharpe, , William, N. Jr. , in Mechanical Properties of MEMS Materials (CRC Press, Boca Raton, FL, 2001), pp. 3–1 to 3.Google Scholar
3 Hemker, K. J and Sharpe, W. N Jr. , Annual Review of Materials Research 37, 92 (2007).Google Scholar
4 Haque, M. A and Saif, M. T. A., Exp. Mech. 43, 248 (2003).Google Scholar
5 Srikar, V. T and Spearing, S. M, Exp. Mech. 43, 238 (2003).Google Scholar
6 Neugebauer, C. A, J. Appl. Phys. 31, 1096 (1960).Google Scholar
7 Read, D.T. and Dally, J.W., Journal of Materials Research 8, 1542 (1992).Google Scholar
8 Sharpe, W. N. J., Yuan, B., and Edwards, R. L, J. Microelectromech. Syst. 6, 193 (1997).Google Scholar
9 Gianola, D. S., thesis Johns Hopkins University (2007).Google Scholar
10 Gianola, D. S et al. , Acta Materialia 54, 2253 (2006).Google Scholar
11 Isono, Y., Namazu, T., and Terayama, N., J. Microelectromech. Syst. 15, 169 (2006).Google Scholar
12 Namazu, T., Takemoto, H., Fujita, H., and Inoue, S., Science and Technology of Advanced Materials 8, 146 (2007).Google Scholar
13 Lin, Ming-Tzer et al. , Microsystem Technologies 12, 1045 (2006).Google Scholar
14 Guo, H. et al. , Nature Materials 6, 735 (2007).Google Scholar
15 Tsuchiya, T., Tabata, O., Sakata, J., and Taga, Y., in Proceedings IEEE. The Tenth Annual International Workshop on Micro Electro Mechanical Systems (IEEE Robotics & Autom. Soc., New York, NY, 1997) pp. 529–524.Google Scholar
16 Greek, S. and Johansson, S., Proceedings of the SPIE - the International Society for Optical Engineering 3224, 344 (1997).Google Scholar
17 Cho, S. W and Chasiotis, I., Exp. Mech. 47, 37 (2007).Google Scholar
18 Sharpe, W. N Jr. et al. , Exp. Mech. 47, 649 (2007).Google Scholar
19 Boyce, B. L, Grazier, J. M, Buchheit, T. E and Shaw, M. J, J. Microelectromech. Syst. 16, 179 (2007).Google Scholar
20 Gianola, D. S and Sharpe, W. N Jr. , Exp. Tech. 28, 23 (2004).Google Scholar
21 Tsuchiya, T., Hirata, M. and Chiba, N., Thin Solid Films 484, 245 (2005).Google Scholar
22 Read, D. T, Cheng, Y., Keller, R. R and McColskey, J. David, Scr. Mater. 45, 583 (2001).Google Scholar
23 Silva, M. G. Da and Bouwstra, S., in Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI (SPIE -International Society for Optical Engineering, Bellingham WA, 2007) pg. 64360.Google Scholar
24http://www.eeel.nist.gov/812/MNT/index.htmlGoogle Scholar
25http://www.semi.org/Google Scholar
26 Sharpe, W. N Jr. et al. , Microelectromechanical Structures for Materials Research (Mater. Res. Soc, Warrendale, PA, 1998).Google Scholar
27 LaVan, D. A et al. in Mechanical Properties of Structural Films (American Society for Testing and Materials, West Conshohocken, PA, 2001) pp. 16–27.Google Scholar