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Relationship Between Thermally Activated Atomic Diffusion Processes in Co-Cu Nanoscale Granular Films and Electric/Magnetic Properties

Published online by Cambridge University Press:  21 February 2011

F. Spizzo
Affiliation:
INFM and Department of Physics, University of Ferrara, Italy
F. Ronconi
Affiliation:
INFM and Department of Physics, University of Ferrara, Italy
P. Vavassori
Affiliation:
INFM and Department of Physics, University of Ferrara, Italy
G. Bordin
Affiliation:
INFM and Department of Physics, University of Ferrara, Italy
D. Bisero
Affiliation:
INFM and Department of Physics, University of Ferrara, Italy
L. Pareti
Affiliation:
IASPEC-CNR, Parma, Italy
G. Turilli
Affiliation:
IASPEC-CNR, Parma, Italy
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Abstract

Co-Cu multilayer granular films deposited onto Si substrates have been submitted to thermal treatments in scanning mode. Their magnetisation and resistance have been studied after applying two different heating rates. The comparison between the experimental data measured before and after the treatment points out that the effect of the annealings depends strongly on the heating rate used. We also present XPS data collected as a function of depth to show how the different heating rate modify the composition and chemical environment produced by thermal treatments.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

[1] Cablong, H. E., Zhang, S., and Levy, P. M., J. Appl. Phys. 75, 6906 (1994).Google Scholar
[2] Sato, H., Kitakami, O., Sakurai, T., Shimada, Y., Otani, Y., and Fukamichi, K., J. Appl. Phys. 81, 1858 (1997).Google Scholar
[3] Allia, P., Knobel, M., Tiberto, P., and Vinai, F., Phys. Rev. B 52, 15398 (1995).Google Scholar
[4] Wang, J. Q. and Xiao, G., Phys. Rev. B 49, 3982 (1994).Google Scholar
[5] Peleg, N., Shtrikman, S., Gorodetsky, G., and Felner, I., J. Magn. Magn. Mat. 191, 349 (1999).Google Scholar
[6] Dorman, J. L., Fiorani, D., and Tronc, E., Advances in Chemical Physics 98, 283 (1997).Google Scholar
[7] Meaden, George Terence, Electrical resistance of metals (Heywood books, London. 1965).Google Scholar
[8] Bisero, D., Bordin, G., Minelli, M., Ronconi, F., Spizzo, F., Baraldi, A., Lizzit, S., Paolucci, G., Pareti, L., and Turilli, G., to be published on Nanostructured Materials.Google Scholar