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Rapid Thermal Processing: Status, Problems and Options After the First 25 Years

Published online by Cambridge University Press:  21 February 2011

Fred Roozeboom
Fred Roozeboom*
Affiliation:
Philips Research, Prof. Holstlaan 4, NL-5656 AA Eindhoven, The Netherlands.
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Abstract

This paper reviews the current status, problems and options in RTP system and process design. Some commercial systems will be discussed along with some improvements that can still be made in temperature reproducibility, process control and yield. This includes some recent developments in temperature reproducibility by compensated emissivity control.

Uniformity issues regarding temperature and process gas hydrodynamics are highlighted in relation to reactor design. Especially in CVD applications, where radiative heat transfer may not longer dominate convective and conductive heat transfer, modeling and visualization of gas flow patterns are becoming increasingly important. Here, reactor design should be such that a laminar flow regime is reached without turbulence and without chemical memory effects upon switching to other gas compositions. Some flow visualization results are illustrated.

Some new options for micro- and nanocrystallization reactions are presented before we conclude with a technology roadmap to the 1-Gbit era.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 303: Symposium G – Rapid Thermal and Integrated Processing II , 1993 , 149
Copyright
Copyright © Materials Research Society 1993

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