Hostname: page-component-848d4c4894-ttngx Total loading time: 0 Render date: 2024-05-20T15:44:59.785Z Has data issue: false hasContentIssue false

The Progress of Plasma Anodization and its Applications

Published online by Cambridge University Press:  21 February 2011

Li Qiong
Affiliation:
Electronics Department, East China Normal University, Shanghai 200062 PR China
Xu Jingfang
Affiliation:
Electronics Department, East China Normal University, Shanghai 200062 PR China
Get access

Abstract

RF stimulated DC discharge mode was developed and used in plasma anodization. Equipment operating in this mode has been set up for anodizing semiconductor materials. To improve the feature of this equipment, enhanced electrode was induced. Anodized oxide film of silicon was applied as gate oxide film in MOSFETs on SOI structure. This paper describes this discharge mode and enhanced electrode and give the properties of the oxide film and MOSFETs.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Sugano, T., ‘Thin Solid Films 92, 1932 (1982); Mater. Res.Soc. Proc. 38, 1985 P. 487.Google Scholar
2. Ho, V. Q., Sugano, T., Thin Solid Films 95, 315 (1982); IEEE Trans. ed-29 (4), 487 (1982).Google Scholar
3. Kiermasz, A. et al, Solid State Electronics 26 (12) 11671172 (1983).Google Scholar
4. Ray, A. K., Reisman, A. J., Electrochem. Soc. Solid State Science and Technology 28 (1) 24602466 (1981).Google Scholar
5. Friedel, P., Gourrier, S. J., Phys. Chem. Solids 44(5) 353364 (1983).Google Scholar
6. Tutsuro, M., Hirohiko, N., et al, Japanese J. of Applied Physics 25 (5) L454 (1986).Google Scholar
7. Roppel, T., et al, J. Vac. Sci. Tech. B4 (1) 295 (1986).Google Scholar