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Polyimide Copolymers Containing Various Levels Of The 6F Moiety For High Temperature And Microelectronic Applications

Published online by Cambridge University Press:  15 February 2011

M. Haider ,
E. Chenevey ,
R. H. Vora ,
W. Cooper ,
M. Glick  and
M. Jaffe
M. Haider
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
E. Chenevey
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
R. H. Vora
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
W. Cooper
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
M. Glick
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
M. Jaffe
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
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Abstract

Trifluoromethyl group-containing polyimides not only show extraordinary electrical properties, but they also exhibit excellent long-term thermo-oxidative stability. Among the most thermomechanically stable structural polyimides are those from 6F dianhydride (6FDA) and 6F diamines. The effects of substituting non-fluorine containing monomers such as BTDA, mPDA and 4,4′-DADPS for the hexafluoroisopropylidene monomers on the dielectric, thermo-oxidative, thermal and mechanical properties of the copolymers were studied.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 35
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Alston, W. B., ”Structure-To-Glass Transition Temperature Relationships in High Temperature Stable Condensation Polyimides,” NASA TM-87113, 1985.Google Scholar
2. Rogers, F. E., U.S. Patent 3,356,648.Google Scholar
3. Rogers, F. E., U.S. Patent 3,959,350.Google Scholar
4. Landis, A. L., et al., U.S. Patent 4,645,824.Google Scholar
5. Vora, R. H., U.S. Patent 4,978,737.Google Scholar
6. Mueller, W., Vora, R. H. and Khanna, D., U.S. Patent 4,978,738.Google Scholar
7. Vora, R. H. and Mueller, W., U.S. Patent 4,978,742.Google Scholar
8. Clair, A. K. St., Clair, T. L. St., Slump, W. S. and Ezzell, K. S., ”Optically Transparent/Colorless Polyimides,” NASA Technical Memorandum 87650, NASA Langley Research Center, Hampton, VA, 1985.Google Scholar
9. Fryd, M., ”Structure-Tg Relationships in Polyimides,” Proceedings from the First Technical Conference on Polyimides, Ed. by Mittal, K. L., Plenum Press, New York, 1984.CrossRefGoogle Scholar
10. Clair, A. K. St., Clair, T. L. St., and Smith, E. N., ”Structure-Solubility Relationships in Polymers,” Ed. by Harris, F. and Seymour, R., Academic Press, New York, 1977.Google Scholar
11. Harris, F. W. and Lanier, L. H., ”Structure-Solubility Relationships in Polyimides,” Ed. by Harris, F. and Seymour, R., Academic Press, New York 1977.Google Scholar
12. Dealy, J. M. and Wissbrun, K. F., ”Melt Rheology and Its Role in Plastics Processing - Theory and Applications,” pp. 577–585, Van Nostrand Reinhold, New York, 1990.Google Scholar