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Passive devices for determining fracture strength of MEMS structural materials

Published online by Cambridge University Press:  01 February 2011

H Kahn ,
R Ballarini  and
A H Heuer
H Kahn
Affiliation:
kahn@case.edu, Case Western Reserve University, Materials Science and Engineering, 10900 Euclid Ave, Cleveland, OH, 44106-7204, United States
R Ballarini
Affiliation:
broberto@umn.edu, University of Minnesota, Civil Engineering, Minneapolis, MN, 55455, United States
A H Heuer
Affiliation:
ahh@case.edu, Case Western Reserve University, Materials Science and Engineering, Cleveland, OH, 44106-7204, United States
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Abstract

In microelectromechanical systems (MEMS) device design and fabrication there exists a need for quick determination of fracture strength. This report describes several passive devices that use the residual stresses contained within structural MEMS materials to determine fracture strength. Stress concentrations of varying degrees are generated at micromachined notch roots, and the critical stress required for failure indicates the fracture strength. A variety of devices have been fabricated from materials, such as polysilicon, silicon nitride, and aluminum, with widely varying residual stresses, including both tensile and compressive.

Keywords

microelectro-mechanical (MEMS)strengthstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD02-02
Copyright
Copyright © Materials Research Society 2008

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References

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