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Passivated Interconnect Lines: Thermomechanical Analysis and Curvature Measurements

Published online by Cambridge University Press:  10 February 2011

A. Wikström ,
P. Gudmundson  and
S. Suresh
A. Wikström
Affiliation:
Department of Solid Mechanics, Royal Institute of Technology (KTH), SE-100 44 Stockholm, Sweden
P. Gudmundson
Affiliation:
Department of Solid Mechanics, Royal Institute of Technology (KTH), SE-100 44 Stockholm, Sweden
S. Suresh
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, U.S.A
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Abstract

It is well known that curvature measurements may be used to obtain volume averaged stresses in thin continuous films and unpassivated lines without knowledge of the material properties of the film or lines. However, recently a method was presented which makes it possible to use curvature measurements also for the determination of volume averaged stresses in passivated lines. Since the problem is statically indeterminate the method requires knowledge of the material properties of the lines and passivation. The sensitivity of the method to uncertainties in material properties and curvature data is here investigated by utilizing the finite element method for anisotropic Cu or Al lines embedded in SiO2 passivation. Furthermore, the method is extended to cover the case of different stress-free temperatures for the lines and passivation respectively.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 439
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Stoney, G. G., “The tension of metallic films deposited by electrolysis”, Proc. Roy. Soc. Lond., A82, 172–175, (1909).Google Scholar
2. Yeo, I. -S., Ho, P. S. and Anderson, S. G. H., “Characteristics of thermal stresses in AI(Cu) fine lines. I. Unpassivated line structures”, J. Appl. Phys., 78, 945–952, (1995).Google Scholar
3. Greenebaum, B., Sauter, A. I., Flinn, P. A. and Nix, W. D., “Stress in metal lines under passivation; comparison of experiment with finite element calculations”, Appl. Phys. Lett., 58,1845–1847, (1991).Google Scholar
4. Shen, Y. -L., Suresh, S. and Blech, I. A., “Stresses, curvatures and shape changes arising from patterned lines on silicon wafers”, J. Appl. Phys., 80, 1388–1398, (1996).Google Scholar
5. Gouldstone, A., Shen, Y-L., Suresh, S. and Thompson, C. V., “Evolution of stresses in passivated and unpassivated metal interconnects”, J. Mater. Res., 13, 1956–1966, (1998).Google Scholar
6. Wikström, A., Gudmundson, P., “Stresses in passivated lines from curvature measurements”, Report 251, Department of Solid Mechanics, Royal Institute of Technology, Stockholm, Sweden, 1999.Google Scholar
7. Landoldt-Börnstein, , Numerical Data and Functional Relationships in Science and Technology, New Series, volume II, Springer, 1979.Google Scholar
8. ABAQUS (1999), Version 5.8, general purpose finite element program, Hibbit, Karlsson and Sorensen, Inc. Pawtucket, RI, USA.Google Scholar
9. Gudmundson, P. and A. Wikström, “Thermoelastic analysis of thin lines on substrates”, Stress Induced Phenomena in Metallization: Fifth International Workshop, American Institute of Physics, 217–228, (1999).Google Scholar