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Pad Degradation During CMP Process: Effect of Soak in Slurry and Water on Thermal and Mechanical Properties of the CMP Pads

Published online by Cambridge University Press:  01 February 2011

A. Tregub ,
G. Ng  and
M. Moinpour
A. Tregub
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
G. Ng
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
M. Moinpour
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
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Abstract

Soak of polyurethane-based CMP pads in tungsten slurry and de-ionized water and its effect on retention of thermal and mechanical properties of the pads was studied using Dynamic Mechanical Analysis (DMA), Thermal Mechanical Analysis (TMA), Thermal Gravimetric Analysis (TGA), and Modulated Differential Scanning Calorimetry (MDSC). Simultaneous cross-linking and plastisizing due to soak were established using DMA and MDSC analysis. The stable operating temperature range and its dependence on soak time were determined using TMA analysis. Substantial difference in diffusion behavior of the “soft” and “hard” pads was discovered: diffusion into the hard pads followed Fickian law [1], while diffusion into the multi-layer soft pads was dominated by the fast filling of the highly porous pad surface with liquid.

During a traditional CMP process, which involves application of polishing pads and slurry, the pad properties can be substantially and irreversibly changed as the result of slurry/rinse water absorption.

The retention of the pad properties after exposure was monitored using such thermal and mechanical techniques, as Thermal Mechanical Analysis (TMA), Dynamical Mechanical Analysis (DMA), Modulated Differential Scanning Calorimetry (MDSC), Thermal Gravimetric Analysis (TGA).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F2.6
Copyright
Copyright © Materials Research Society 2003

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References

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