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Oxidation Kinetics of Metastable Electrodeposited and Sputtered Nickel Thin Films Via Thermogravimetric Analysis

Published online by Cambridge University Press:  21 February 2011

Ann C. Herrmann ,
D William E. Brower JR.  and
Shashi Lalvani
Ann C. Herrmann
Affiliation:
Marquette University, Dept. of Mechanical and Industrial Engineering, Milwaukee, waukee, WI 53233
D William E. Brower JR.
Affiliation:
Marquette University, Dept. of Mechanical and Industrial Engineering, Milwaukee, waukee, WI 53233
Shashi Lalvani
Affiliation:
Southern Illinois University, Mechanical Engineering and Energy Processes Department, Carbondale, IL
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Abstract

The effetzct of the amorphous state and the disordered sputtered state on the oxidation kinetics of nickel films was investigated by a comparison with annealed films and with pure nickel foil and powder. Specimens were exposed to oxygen in a thermogravimetric analyzer (TGA) in the temperature scan mode. An electrodeposited amorphous Ni-P alloy and sputtered pure nickel films were annealed in situ in argon and then oxidized in the same manner as the as deposited films. The as sputtered films oxidized faster at 500%C than pieces of the same film first annealed in argon. Conversely, the as deposited Ni-P film was more oxidation resistant below its crystallization temperature than the annealed Ni-P films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 187: Symposium J – Thin Film Structures and Phase Stability , 1990 , 143
Copyright
Copyright © Materials Research Society 1990

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References

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