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Over 20% Efficiency Mechanically Stacked Multi-Junction Solar Cells Fabricated by Advanced Bonding Using Conductive Nanoparticle Alignments

Published online by Cambridge University Press:  29 May 2013

Kikuo Makita ,
Hidenori Mizuno ,
Hironori Komaki ,
Takeyoshi Sugaya ,
Ryuji Oshima ,
Hajime Shibata ,
Koji Matsubara  and
Shigeru Niki
Kikuo Makita
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Hidenori Mizuno
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Hironori Komaki
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Takeyoshi Sugaya
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Ryuji Oshima
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Hajime Shibata
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Koji Matsubara
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
Shigeru Niki
Affiliation:
National Institute of Advanced Industrial Science and Technology (AIST) AIST Tsukuba, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, JAPAN
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Abstract

This paper shows a new semiconductor bonding technology for mechanically stacked multi-junction solar cells. Our strategy is the combination of conductive nanoparticle alignments and the van der Waals bonding technique. With this method, reasonably low bonding resistances and minimal optical absorption losses were simultaneously attained for the use of mechanically stacked solar cells. We examined a GaInP(Eg-1.89 eV)/GaAs (Eg-1.42 eV)/InGaAsP (Eg-1.15 eV) three-junction solar cell fabricated with this bonding method. As a result, the total efficiency of 22.5% was achieved, which was in good agreement with the theoretically predicted value. These results suggested that our bonding method is highly useful to fabricate high-efficiency mechanically stacked multi-junction solar cells.

Keywords

photovoltaicbondingnanostructure
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1538: Symposium FF – Compound Semiconductors: Thin-Film Photovoltaics, LEDs and Smart Energy Controls , 2013 , pp. 167 - 171
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Tanabe, K., Morral, A. F., Atwater, H. A., Aiken, D. J., and Wanlass, M. W., Appl. Phys. Lett., 89, 102106(2006).CrossRefGoogle Scholar
Sameshima, T., Takenezawa, J., Hasumi, M., Koida, T., Kaneko, T., Karasawa, M., and Kondo, M., Jpn. J. Appl. Phys., 50, 052301 (2011)CrossRefGoogle Scholar
Makita, K., Soya, H., Komaki, H., Sai, H., Tampo, H., Sugaya, T., Furue, S., Ishizuka, S., Yamada, A., Furukawa, A., Shibata, H., Matsubara, K., and Niki, S., Technical Digest of the 21st International Photovoltaic Science and Engineering Conference, 2B-4O-10 (2011).Google Scholar
Makita, K., Mizuno, H., Soya, H., Komaki, H., Sai, H., Tampo, H., Sugaya, T., Oshima, R., Furukawa, A., Shibata, H., Matsubara, K., and Niki, S., Proceedings of the 27th European Photovoltaic Solar Energy Conference, 78-80 (2012).Google Scholar
Mizuno, H., Makita, K., and Matsubara, K., Appl. Phys. Lett., 101, 191111(2012)CrossRefGoogle Scholar
Yablonovitch, E., Hwang, D. M., Gmitter, T. J., Florez, L. T., and Harbison, J. P., Appl. Phys. Lett., 56, 2419 (1990).CrossRefGoogle Scholar
Sze, S. M., “Physics of Semiconductor Devices”, John Wiley & Sons, 640–653(1969)Google Scholar