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Ohmic Contact Formation Mechanism in the Ge/Pd/N-GaAs System

Published online by Cambridge University Press:  25 February 2011

E.D. Marshall
Affiliation:
University of California at San Diego, Department of Electrical and Computer Engineering, R-007, La Jolla, CA 92093
S.S. Lau
Affiliation:
University of California at San Diego, Department of Electrical and Computer Engineering, R-007, La Jolla, CA 92093
C.J. Palmstrøm
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
T. Sands
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
C.L. Schwartz
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
S.A. Schwarz
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
J.P. Harbison
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
L.T. Florez
Affiliation:
Bellcore, 331 Newman Springs Road, Red Bank, NJ 07701-7040
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Abstract

Annealed Ge/Pd/n-GaAs samples utilizing substrates with superlattice marker layers have been analyzed using high resolution backside secondary ion mass spectrometry and cross-sectional transmission electron microscopy. Interfacial compositional and microstructural changes have been correlated with changes in contact resistivity. The onset of good ohmic behavior is correlated with the decomposition of an intermediate epitaxial Pd4(GaAs,Ge2) phase and solid-phase regrowth of Ge-incorporated GaAs followed by growth of a thin Ge epitaxial layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

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