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Noise of a-Si:H Pin Diode Pixels in Imagers at Different Operating Conditions

Published online by Cambridge University Press:  15 February 2011

F. Blecher
Affiliation:
Universität-GH Siegen, Institut für Halbleiterelektronik (IHE), D-57068 Siegen, Germany
B. Schneider
Affiliation:
Universität-GH Siegen, Institut für Halbleiterelektronik (IHE), D-57068 Siegen, Germany
J. Sterzel
Affiliation:
Universität-GH Siegen, Institut für Halbleiterelektronik (IHE), D-57068 Siegen, Germany
M. Böhm
Affiliation:
Universität-GH Siegen, Institut für Halbleiterelektronik (IHE), D-57068 Siegen, Germany
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Abstract

The noise current spectral density of an a-Si:H pin diode can be calculated with experimentally determined flicker noise coefficients by superposition of the shot and flicker noise spectra of photocurrent and dark current. The dependence of the flicker noise current spectral density in pin diodes on the pixel area is calculated with our expansion of Hooge's law for flicker noise. We propose a new method for the calculation of dynamic range (DR) and signal-to-noise ratio (SNR) in pin diode pixels as a function of pixel area, dark current, photocurrent and the integration time of the imager. DR and SNR of the pin diodes are calculated for Thin Film on ASIC (TFA) image sensors.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

1. Schneider, B., Fischer, H., Benthien, S., Keller, H., Lulé, T., Rieve, P., Sommer, M., Schulte, J. and Böhm, M., Technical Digest of International Electron Devices Meeting 1997, 209212.Google Scholar
2. Blecher, F. Seibel, K. and Bihm, M., Photo and Dark Current Noise in a-Si:H pin Diodes at Forward and Reverse Bias, Mat. Res. Symp. Proc. 507, (1998).Google Scholar
3. Hooge, F.N., IEEE Trans. Electron Devices 41, 19261935 (1994).Google Scholar
4. Blecher, F., Seibel, K., Sterzel, J., Hillebrand, M. and Böhm, M., DFG Forschungsbericht, contract Bo 772/3-2, Universität-GH Siegen, 1998.Google Scholar
5. Lull, T., Keller, H., Wagner, M., Böhm, M., Hamann, C.D. and Humm, L., to be published in Advanced Microsystems for Automotive Applications 99, edited by Ricken, D.E. and Gessner, W., (Springer Verlag, Berlin, 1999).Google Scholar
6. Benthien, S., Wagner, M., Verhoeven, M., Böhm, M., Schneider, B., Uffel, B. van and Librecht, F., A Vertically Integrated High Resolution Active Pixel Image Sensor for Deep Submicron CMOS Processes, to be presented at 1999 IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors, Nagano, Japan, (1999).Google Scholar