Hostname: page-component-76fb5796d-r6qrq Total loading time: 0 Render date: 2024-04-27T02:05:21.607Z Has data issue: false hasContentIssue false
  • English
  • Français

A New Simple Method for Fabrication of Fine Metal Patterns

Published online by Cambridge University Press:  17 March 2011

Yasuyuki Hotta ,
Koji Asakawa ,
Shigeru Matake  and
Toshiro Hiraoka
Yasuyuki Hotta
Affiliation:
Advanced Materials and Devices Laboratories, Corporate Research & Development Center, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwaiku, Kawasaki 212-8582, Japan
Koji Asakawa
Affiliation:
Advanced Materials and Devices Laboratories, Corporate Research & Development Center, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwaiku, Kawasaki 212-8582, Japan
Shigeru Matake
Affiliation:
Advanced Materials and Devices Laboratories, Corporate Research & Development Center, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwaiku, Kawasaki 212-8582, Japan
Toshiro Hiraoka
Affiliation:
Advanced Materials and Devices Laboratories, Corporate Research & Development Center, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwaiku, Kawasaki 212-8582, Japan
Get access

Abstract

We developed a new method for easy fabrication of micrometer-scale fine metal patterns on substrates. The patterns can be fabricated at low cost, at low processing temperature, and on uneven substrates as well as on plane surfaces. The method involves, first, forming hydrophilic and hydrophobic patterns on the substrates, and, second, depositing metal by electroless plating on the hydrophilic area. Hydrophilic and hydrophobic patterns were formed on a sensitizer containing naphthoquinonediazide (NQD) units coated on the substrates by the exposure. In the exposed areas, metal particles that are catalysts for electroless copper plating were adsorbed in the ion-exchange reaction and then the reduction treatment was performed. Copper was selectively deposited by the self-catalyst mechanism, according to the exposed patterns. All experimental processes can be carried out at room temperature. Using this new method, copper line patterns of 25 μm and copper dot patterns of 15 μm diameter were fabricated on the substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 636: Symposium D – Nonlithographic and Lithographic Methods of Nanofabrication-From Ultralarge Scale , 2000 , D9.19.1
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hirch, T.J., Miracky, R.F., and Lin, C., Appl. Phys. Lett., 57 (13), 1357 (1990)Google Scholar
2. Schott, A.G., Braren, B., O'Sullivan, E.J.M., Saraf, R.F., Bailey, P., and Roldan, J., J. Electrochem. Soc., 142, 944 (1995)Google Scholar
3. Nagamine, S., Kobayakawa, K., and Sato, Y., Hyoumengijutsu, 49, 12, 63 (1998)Google Scholar
4. Tomita, M. and Murahara, M., in Materials Science of Microelectrochemical System (MEMS) Devices, (Mater. Res. Soc. Proc. 546, Boston, MA, 1998) pp. 207–212 Google Scholar
5. Niino, H., Yabe, A., Appl. Phys. Lett., 63, 3527 (1993)Google Scholar
6. Rye, R.R., Ricco, A.J., Perry, W., Hampden-Smith, M.J., and Kodas, T.T., Plast. Eng. (N. Y. ), 43 (Metallized Plastics), 15 (1998)Google Scholar
7. Saita, M., Nawafune, H., Kanai, T., Nishioka, T., and Mizumoto, S., ECWC8, Tokyo 99, T4–3 (1999)Google Scholar
8. Dammel, R., in Tutorial Text in Optical Engineering, Edited by O'Shea, D.C. (SPIE Publishers, Bellingham, 1993) vol. TT11 Google Scholar