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New Multilayered Materials with Low Dielectric Permittivity for VLSI Applications

Published online by Cambridge University Press:  21 February 2011

V. Mehrotra ,
T. Kwon  and
E. P. Giannelis
V. Mehrotra
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
T. Kwon
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
E. P. Giannelis
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

A new generation of substrate materials with low dielectric permittivity have been developed. These new ceramic-based nanocomposites consist of a quasi two-dimensional, multilayered structure realized by the intercalation of molecular species into the galleries of a host lattice. The materials have been characterized by x-ray diffraction, electronic and infrared spectroscopy. The relative permittivities vary between 2.5 and 4 at 1 MHz. The new hybrids can be processed at relatively low temperatures (below 350°C) and allow for step coverage of submicron structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 181
Copyright
Copyright © Materials Research Society 1990

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References

1. Schwartz, B., Bull. Am. Cer. Soc., 63, 577 (1984).Google Scholar
2. Cross, L.E. and Gururaja, T.R., in Electronic Packaging Materials Sscience II, edited by Jackson, K.A., Pohanka, R.C., Uhlmann, D.R. and Ulrich, D.R. (Mater. Res. Soc. Proc. 72, Pittsburgh, PA 1986) pp. 53–65.Google Scholar
3. Cagnon, D.R., Capistran, J.D., Karasz, F.E. and Lenz, R.W., ACS Polym. Prepr., 25, 284 (1984).Google Scholar
4. Kwon, T. and Pinnavaia, T.J., Chem. Mat., 1, 381 (1989).Google Scholar
5. Pinnavaia, T.J., Science, 220, 365 (1983).Google Scholar
6. Mehrotra, V. and Giannelis, E.P., unpublished results.Google Scholar