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Nanoindentation of Lead Free Solders for Harsh Environments

Published online by Cambridge University Press:  01 February 2011

Vitor Farinha Marques ,
Patrick Grant  and
Colin Johnston
Vitor Farinha Marques
Affiliation:
vitor.marques@materials.ox.ac.uk, University of Oxford, Department of Materials, Begbroke Business and Science Park, Sandy Lane, Yarnton, OX5-1PF, Oxford, N/A, United Kingdom
Patrick Grant
Affiliation:
patrick.grant@materials.ox.ac.uk, University of Oxford, Department of Materials, Oxford, OX5 1PF, United Kingdom
Colin Johnston
Affiliation:
colin.johnston@materials.ox.ac.uk, University of Oxford, Department of Materials, Oxford, OX5 1PF, United Kingdom
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Abstract

To better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C. The creep behaviour of the different micro-phases was also studied as function of temperature. The hardness and elastic modulus of Cu6Sn5, Cu3Sn had a weak dependence on temperature, while primary Sn, eutectic regions and electroplated Cu hardness and modulus were sensitive to temperature. Creep studies indicated that intermetallic were more creep resistant than softer phases that readily underwent creep, the type and rate of which was shown to be strongly temperature dependent.

Keywords

nano-indentationmicroelectronicssoldering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1079: Symposium N – Materials and Processes for Advanced Interconnects for Microelectronics , 2008 , 1079-N05-13
Copyright
Copyright © Materials Research Society 2008

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References

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