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Nanoindentation Characterization of PECVD Silicon Nitride on Silicon Subjected to Mechanical Fatigue Loading

Published online by Cambridge University Press:  20 January 2011

Z-K Huang ,
K-S Ou  and
K-S Chen
Z-K Huang
Affiliation:
Department of Mechanical Engineering National Cheng-Kung University Tainan, Taiwan, 70101
K-S Ou
Affiliation:
Department of Mechanical Engineering National Cheng-Kung University Tainan, Taiwan, 70101
K-S Chen
Affiliation:
Department of Mechanical Engineering National Cheng-Kung University Tainan, Taiwan, 70101
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Abstract

In this work, the mechanical properties of PECVD silicon nitride deposited on silicon substrates by two different processing conditions were investigated. Indentation method was primary used for qualitatively examining the effect of process conditions to the achieved mechanical properties. The experimental results indicated that the residual stress, fracture toughness and interfacial strength, as well as the fatigue crack propagation were strongly depended on the processing conditions such as deposition temperatures and chamber pressures. Preliminary results indicated that the specimen deposited at a lower temperature and a lower pressure exhibited a much less residual tensile stress and a better interface strength. On the other hand, it was found that RTA could enhance the interfacial strength but the generated high tensile strength could actually reduce the equivalent toughness and leads to structural reliability concerns. In summary, the characterization results should be possible to provide useful information for correlating the mechanical reliability with the processing parameters for future structural design optimization and for improving the structural integrity of PECVD silicon nitride films for MEMS and IC fabrication.

Keywords

plasma-enhanced CVD (PECVD) (deposition)fatiguenano-indentation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1299: Symposium S – Microelectromechanical Systems—Materials and Devices IV , 2011 , mrsf10-1299-s09-06
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

[1] Lin, I.K., Wu, P.H., Ou, K.S., Chen, K.S. and Zhang, X., Mater. Res. Soc. Symp. Proc Volume 1222, Warrendale, PA, 2010), 1222-DD02-20(2010)Google Scholar
[2] Stoney, G. G., Proceedings of the Royal Society, 82, 172(1909).Google Scholar
[3] Wu, P.H., Master Thesis, Mechancal Eng. Dept. National Cheng-Kung University, Taiwan, 2009 Google Scholar
[4] Oliver, W. C. and Pharr, G. M., J. Mater. Res., 19, 3(2004).CrossRefGoogle Scholar
[5] Huang, H., Winchester, K., Suvorova, A., Lawn, B., Liu, Y., Hu, X., Dell, J., and Faraone, L., Material Sci. Eng. A, 435-436, 453-459(2006)CrossRefGoogle Scholar
[6] Marshall, D. B. and Lawn, B. R., ASTM Spec. Tech. Publ., 889, 26(1986).Google Scholar
[7] Zhang, T.Y., Chen, L.Q. and Fu, R., Acta Materialia, 47,3869(1999)Google Scholar
[8] Anderson, T. L., Fracture Mechanics Fundamentals and Applications,(CRC Press, 1991)Google Scholar