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Nanoindentation and Tensile Behavior of Copper Films

Published online by Cambridge University Press:  10 February 2011

D. Read ,
R. Geiss ,
J. Ramsey ,
T. Scherban ,
G. Xu ,
J. Blaine ,
B. Miner  and
R.D. Emery
D. Read
Affiliation:
National Institute of Standards and Technology, Boulder, CO 80305
R. Geiss
Affiliation:
National Institute of Standards and Technology, Boulder, CO 80305
J. Ramsey
Affiliation:
Reed College, Portland, OR 97202
T. Scherban*
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
G. Xu
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
J. Blaine
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
B. Miner
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
R.D. Emery
Affiliation:
Components Research, Intel Corp., Chandler, AZ 85226
*
†Corresponding author: 503.613.1716, tracey.scherban@intel.com
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Abstract

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U4.3
Copyright
Copyright © Materials Research Society 2002

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References

1. Kramer, D., Huang, H., Kriese, M., Robach, J., Nelson, J., Wright, A., Bahr, D., and Gerberich, W.W., Acta Materialia 47(1), 333 (1999).Google Scholar
2. Read, D.T. and Dally, J.W., Int. J. of Microcircuits Elec. Pack. 16(4), 313 (1993).Google Scholar
3. Xie, C., Emery, R.D., Yang, S.-Y., and Tong, W., MRS Symp. Proc. 695, L5.2.1 (2002).Google Scholar
4. Volinsky, A.A., Vella, J., Adhihetty, I.S., Sarihan, V., Mercado, L., Yeung, B.H., and Gerberich, W.W., MRS Symp. Proc. 649, Q5.3.1 (2001).Google Scholar
5.A Digital Instruments Dimension 3100Z Series scanning probe microscope was used, with a Hysitron Triboscope attachment.Google Scholar
6. Watanabe, T., Journal of the Japan Institute of Metals 66(4), 339 (2002).Google Scholar
7. Read, D.T., Cheng, Y-W., Keller, R.R., and McColskey, J.D., Scripta Materialia 45, 583 (2001).Google Scholar
8. Hertzberg, R.W., Deformation and Fracture Mechanics of Engineering Materials, Third Ed., Wiley, NY (1989).Google Scholar
9. Huang, H. and Spaepen, F., Acta Materialia 48(12), 3261 (2000).Google Scholar
10. Ruud, J.A., Josell, D., Spaepen, F., and Greer, A.L., J. Mater. Res. 8(1), 112 (1993).Google Scholar
11. Read, D.T., Meas. Sci. Technol. 9, 676 (1998).Google Scholar
12. ASM Metals Handbook, Eighth Edition, Volume 1.Google Scholar
13. Emery, R.D. and Povirk, G.L., Acta Materialia 51(7), 2079 (2003).Google Scholar
14. Hall, E.O., Proc. Phys. Soc. B 64, 747 (1951).Google Scholar
15. Petch, N.J., JISI 173, 25 (1953).Google Scholar
16. Merz, M.D. and Dahlgren, S.D., J. Appl. Phys. 46, 3235 (1975).Google Scholar
17. Courtney, T.H., Mechanical Behavior of Materials, McGraw-Hill, New York (1990).Google Scholar
18. Emery, R.D. and Povirk, G.L., Acta Materialia 51(7), 2067 (2003).Google Scholar