Hostname: page-component-84b7d79bbc-c654p Total loading time: 0 Render date: 2024-07-27T16:56:50.825Z Has data issue: false hasContentIssue false

Nanoindentation and Microstructural Evolution Studies of DC Magnetron Sputtered Chromium Nitride Thin Films

Published online by Cambridge University Press:  21 March 2011

A.B. Agarwal
Affiliation:
Now at Submicron Development Center in AMD, Sunnyvale, CA
B.A. Rainey
Affiliation:
Now at IBM, Burlington, VT
S.M. Yalisove
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
J.C. Bilello
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
Get access

Abstract

Nanoindentation experiments have been performed to assess the mechanical behavior of chromium nitride (CrxNy) thin films sputtered in different deposition geometries and with varying Ar and N2 pressures. The hardness and elastic modulus of chromium nitrides are of great interest with regard to their applications. In the present work, two different deposition geometries, i.e. multi-substrate and confocal, were used to sputter (DC magnetron) a CrxNy layer on Si (100) wafers at varying nitrogen flow rates. The results of the nanoindentation experiments indicate that, over a similar argon and nitrogen regime, the CrxNy films grown in a multi- substrate geometry exhibit higher hardness and elastic modulus on the average than those grown in the confocal geometry. Furthermore, it was found that in the multi-substrate geometry the hardness and elastic modulus of the films were significantly higher than those in the confocally deposited films for a specific regime of the nitrogen flow rate (10-14 sccm). Finally, observations of the mechanical properties trends could be correlated with a higher degree of anisotropic stress for films grown in the multi-substrate in comparison to the confocal geometry.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Aubert, A. and Gillet, R., Thin Solid Films, 108, 165 (1983).Google Scholar
[2]Cholvy, G. and Derep, J.L., Thin Solid Films, 126, 51 (1985).Google Scholar
[3]Terrat, P., Gaucher, A. and Hadj-Rabah, H., Surf. Coat. Technol. 45, 59 (1991).Google Scholar
[4]Saha, R., Inturi, R., Barnard, J.A., Surf. Coat. Technol. 82, 42 (1996).Google Scholar
[5]Ballhause, P., Hensel, B., Rost, A. and Schussler, H., Mater. Sci. & Eng. A163, 193 (1993).Google Scholar
[6]Huang, Z.P., Sun, Y. and Bell, T., Wear 173, 13 (1994).Google Scholar
[7]Nix, W.D., Metall. Trans. A 20, 2217 (1989).Google Scholar
[8]Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).Google Scholar
[9]Doerner, M.F. and Nix, W.D., J. Mater. Res. 1, 601 (1986).Google Scholar
[10]Bhushan, B., Nanomechanical properties of solid surfaces and thin films, in: Bhushan, B. (Ed.), Handbook of Micro/Nanotribology, CRC Press, Boca Raton, FL, 1995, pp. 321396.Google Scholar
[11]Zhao, Z.B., Ph.D. Dissertation, “Evolution of Microstructure and Residual Stress in Sputtered CrN and CrxNy Thin Films,” University of Michigan, Ann Arbor, MI (1999).Google Scholar
[12]Rainey, B.A., Bilello, J.C., Yalisove, S.M., to be published.Google Scholar
[13]Quinto, D.T., J. Vac. Sci. Technol., A6 no. 3, 2149 (1988).Google Scholar
[14]Kamachi, K., Ito, T. and Yamamoto, T., Surf. J. Intl. 1, 82 (1986).Google Scholar
[15]Bather, K.H., Herrman, U. and Schroer, A., Surf. Coat. Technol. 74–75, 793 (1995).Google Scholar
[16]Berg, G., Friedrich, C., Broszeit, E. and Berger, C., Surf. Coat. Technol. 86–87, 184 (1996).Google Scholar
[17]Doerner, M.F. and Nix, W.D., J. Mater. Res. 1, 601609 (1986).Google Scholar
[18]Doerner, M.F., Gardner, D.S., and Nix, W.D., J. Mater. Res. 1, 845851 (1987).Google Scholar
[19]Nix, W.D., J. Mater. Res. A234, 3744 (1997).Google Scholar