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Multilevel Interconnection Technologies and Future Requirements for Logic Applications

Published online by Cambridge University Press:  10 February 2011

M. Brillouët
M. Brillouët*
Affiliation:
France Telecom, Centre Commun CNET SGS-THOMSON, 38926 Crolles, France
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Abstract

The performance and cost of the logic ICs is more and more dominated by the interconnections. Reducing the capacitances in the advanced processes, especially with low k dielectrics, is a priority, while a differentiated approach can be applied for lowering the connection resistances, e.g. in adapting the interconnect material to specific levels. Integrating new materials leads to difficult trade-offs in order to achieve a good electrical performance of the circuit. Finally the increased number of levels of interconnection addresses other fields like integration density, defectivity reduction or cost.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 514: Symposium I – Advanced Interconnects & Contact Materials & Processes for… , 1998 , 29
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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