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Modification on Hydrophilic property for Harsh Environment

Published online by Cambridge University Press:  01 February 2011

Hsin-Chang Tsai ,
Yu-Ru Chang  and
Tai-Kang Shing
Hsin-Chang Tsai
Affiliation:
darwin.tsai@delta.com.tw, Delta Electronics Inc., MEMS Research Center, 252, Shang Ying Road, ,, Kuei San, Taoyuan Hsien, 333, Taiwan, +886-3-3591968 ext 2095, +886-33591991
Yu-Ru Chang
Affiliation:
yuru.chang@delta.com.tw, Delta Electronics Inc., MEMS Research Center, Taiwan
Tai-Kang Shing
Affiliation:
tk.shing@delta.com.tw, Delta Electronics Inc., MEMS Research Center, Taiwan
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Abstract

In this research, a 1∼2 um NiCo film coated by electroplating technique as protection film in high temperature environment was studied. The improvements of hydrophilic property and high temperature stability by coating NiCo film upon pure Cu plate have been characterized through experiments. In thermal stability characterization, the specimens were put into a temperature-controlled oven and applied a thermal load at 100°C, 200°C and 300°C for annealing. After thermal annealing, the hydrophilic property was characterized to confirm that NiCo film was stable in high temperature environment. The hydrophilic property was represented by the contact angle between the DI water and the surface of NiCo film. The outgasing effect of contaminated polymer was also study. The electroplated NiCo film has advantages of good hydrophilic property, high temperature stability and easy fabrication. Therefore, the NiCo film could help the development of thermal related products.

Keywords

microelectro-mechanical (MEMS)electrodepositionpassivation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 890: Symposium Y – Surface Engineering for Manufacturing Applications , 2005 , 0890-Y08-02
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1. Steen, M.L., Hymas, L., Havey, E.D., Capps, H.E., Castner, D.G. and Fisher, E.R., “Low temperature plasma treatment of asymmetric polysulfone membranes for permanent hydrophilic surface modification,” J. of Membrane Science, 188, pp. 97–114, 2001.Google Scholar
2. Velev, O.D., Constantinides, G.N., Avraam, D.G., Payatakes, A.C. and Borwankar, R.P., “Investigation of thin liquid film of small diameters and high capillary pressures by a miniatureized cell,” J. of Colloid and Interface Science, 175, pp. 68–76, 1995.Google Scholar
3. Akapiev, G.N., Dmitriev, S.N., Erler, B., Shirkova, V.V., Schulz, A. and Pietsch, H., “Ion track membranes providing heat pipe surfaces with capillary structures,” Nuclear Instruments and Methods in Physicas Research B, 208, pp. 133–136, 2003.Google Scholar
4. Chang, S., Chia, M., Castillo-Borelley, P., Higdon, W., Jiang, Q., Johnson, J., Obedier, L., Putty, M., Shi, Q., Sparks, D. and Zarabadi, S., “An electroformed CMOS integrated angular rate sensor,” Sensors and Actuators A, 66, pp. 138–143, 1998.Google Scholar
5. Tajiri, K., Nakamura, T., Kabeya, Z., Yamanaka, Y., Naito, F., Kato, T. and Takasaki, E., “Development of an electroformed copper lining for accelerator components,” Electrochimica Acta, 47, pp. 143–148, 2001.Google Scholar
6. Johansen, L. S., Ginnerup, M., Ravnkilde, J.T., Tang, P.T. and Lochel, B., “Electroforming of 3D microstructures on highly structured surfaces,” Sensors and Actuators A, 83, pp. 156–160, 2001.Google Scholar