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Modeling and Model Validation for RTP Design

Published online by Cambridge University Press:  10 February 2011

M. Fordham ,
M. Pan ,
J. Hu  and
F. Y. Sorrell
M. Fordham
Affiliation:
Nortel Technology, 35 Davis Drive, RTP, NC 27709, fordham@nortel.ca
M. Pan
Affiliation:
Computer Science Department, North Carolina State University, Raleigh, NC, 27695
J. Hu
Affiliation:
Mechanical Engineering Dept., North Carolina State University, Raleigh, NC, 27695–7910
F. Y. Sorrell
Affiliation:
Mechanical Engineering Dept., North Carolina State University, Raleigh, NC, 27695–7910
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Abstract

Spectral and spectral band irradiance sensors are developed to measure the spatial heat flux distribution from a rapid thermal processor (RTP) lamp bank. They are used in conjunction with a Sensarray thermocouple wafer to evaluate the thermal uniformity of one axially symmetric lamp bank from a 3 zone RTP system. Measured performance of the lamp bank differs sharply from predictions obtained using a numerical ray trace model. Discrepancies between experimental measurements and model results are resolved by blackening a beveled (focusing) surface introduced to shield process lamp bases from overheating. Further modeling confirms that the bevel causes undesirable focusing of lamp radiation on the planar wafer surface. The shape of the focused component of the irradiance profile is highly dependent on the lamp radiance spatial distribution assumed in the model.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 470: Symposium F – Rapid Thermal and Integrated Processing IV , 1997 , 175
Copyright
Copyright © Materials Research Society 1997

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References

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