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Microstructure of Physical Vapour Deposited Ti-Si-N Coatings

Published online by Cambridge University Press:  17 March 2011

Florian Kauffmann ,
Gerhard Dehm ,
Eduard Arzt ,
Veit Schier ,
Sascha Henke ,
Alaexander Schattke  and
Thomas Beck
Florian Kauffmann
Affiliation:
Max Planck Institut für Metallforschung, Seestraße 92, 70174 Stuttgart, Germany
Gerhard Dehm
Affiliation:
Max Planck Institut für Metallforschung, Seestraße 92, 70174 Stuttgart, Germany
Eduard Arzt
Affiliation:
Max Planck Institut für Metallforschung, Seestraße 92, 70174 Stuttgart, Germany
Veit Schier
Affiliation:
Walter AG, Derendinger Str. 53, Postfach 20 49, 72072 Tübingen, Germany
Sascha Henke
Affiliation:
Robert Bosch GmbH, Postfach 10 60 50, 70049 Stuttgart, Germany
Alaexander Schattke
Affiliation:
Robert Bosch GmbH, Postfach 10 60 50, 70049 Stuttgart, Germany
Thomas Beck
Affiliation:
Robert Bosch GmbH, Postfach 10 60 50, 70049 Stuttgart, Germany
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Abstract

The influence of Si on the microstrucure of Ti-Si-N coatings was studied, since it controls the mechanical properties of the coatings. At low Si-contents columnar {111}-textured TiN grains form. Increasin the Si-content to >4at% causes a transition to equiaxed {200}-textured TiN grains. The equiaxed TiN grains reveal grain diameters of ∼6 nm for coatings containing 11 at% Si.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 704: Symposium W – Nanoparticulate Materials , 2001 , W7.3.1
Copyright
Copyright © Materials Research Society 2002

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References

1. Vepřek, S., Reiprich, S., and Shizi, Li, Appl. Phys. Lett. 66, 2640 (1995).Google Scholar
2. Shizhi, Li, Yulong, S., and Hongrui, P., Plasma Chem. Plasma Process, 12, 287 (1992)Google Scholar
3. Vepřek, S. and Reiprich, S., TSF 268, 64 (1995).Google Scholar
4. Vepřek, S., J. Vac. Sci. Technol. A 17, 2401 (1999).Google Scholar
5. Christiansen, S., Albrecht, M., Strunk, H.P., and Vepřek, S., J. Vac. Sci. Technol. B 16, 19 (1998).Google Scholar
6. Diserens, M., Patscheider, J. und Lévy, F., Surf. Coat. Technol. 108–109, 241 (1998).Google Scholar
7. Vaz, F., Rebouta, L., Ramos, S., Silva, M.F. da, and Soares, J.C., Surf. Coat. Technol. 108–109, 236 (1998).Google Scholar
8. Diserens, M., Patscheider, J. und Lévy, F., Surf. Coat. Technol. 120–121, 158 (1998).Google Scholar
9. Spolenak, R., Heiland, B., Witt, C., Keller, R., Müllner, P., and Arzt, E., Prakt. Metallogr. 37, 90 (2000)Google Scholar
10. Thomsen, N.B., Horsewell, A., Mogensen, K.S., Eskildsen, S.S., Mathiasen, C., and Bøttiger, J., TSF 333, 50 (1998)Google Scholar