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Micro-raman spectroscopic investigation of NiSi films formed on BF2+-, B+-and nonimplanted (100) Si substrates

Published online by Cambridge University Press:  01 February 2011

S. K. Donthu
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
D. Z. Chi
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
A. S. W. Wong
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
S. J. Chua
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602 Centre of Optoelectronics, Department of Electrical Engineering, National University of Singapore, 2 Engineering Drive, Singapore 119260
S. Tripathy
Affiliation:
Centre of Optoelectronics, Department of Electrical Engineering, National University of Singapore, 2 Engineering Drive, Singapore 119260
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Abstract

Micro-Raman spectroscopic technique was used to investigate vibrational properties of NiSi thin films formed on three different (100) Si substrates: non-implanted, 20-keV BF2+-implanted, and 20-keV B+-implanted. Raman spectroscopy was also performed on NiSi powder to identify various phonon modes associated with different selection rules of group theory. It was found that Raman peaks of NiSi thin films formed on BF2+ implanted substrate were broader and shifted to lower frequency side compared to films formed on other substrates. The broadening of the Raman peaks in these films, which also exhibit much improved thermal stability, is attributed to small grains resulting probably from fluorine segregation to grain boundaries and interface. It is further proposed that besides grain boundary segregation, the excess fluorine in the film influences the stress-state in the silicide film resulting in shift of phonon peak positions.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

1. Morimoto, T., Ohguro, T., Momose, H.S., Linuma, T., Kunishima, I., Suguro, K., Katakabe, I., Nakajima, H., Tsuchiaki, M., Ono, M., Katsumata, Y. and Iwai, H., IEEE Transactions on Electron Devices, 42, 5, 915 (1995).Google Scholar
2. Xu, D.-X., Das, S.R., Peters, C.J. and Erickson, L.E., Thin Solid Films, 326 143 (1998).Google Scholar
3. Lim, E.H., Karunasiri, G., Chua, S.J., Shen, Z.X, Wong, H., Pey, K.L., Lee, K.H. and Chan, L., Microelectronic Engineering, 43-44, 611 (1998).Google Scholar
4. Codella, P.J., Adar, F. and Liu, Y.S., Appl. Phys. Lett., 46 1076 (1985).Google Scholar
5. Nemanich, R.J., Tsai, C.C., Stafford, B.L., Abelson, J.R. and Sigmon, T.W., Mater. Res. Soc. Symp. Proc., 25 9 (1983).Google Scholar
6. Meinardi, F., Quilici, S., Borghesi, A. and Artioli, G., Appl. Phys. Lett., 75 (20), 3090 (1999).Google Scholar
7. Lee, P.S., Mangelinck, D., Pey, K.L., Shen, Z.X., Ding, J., Osipowicz, T. and See, A., Electrochemical and Solid-State Letters, 3 (3), 153 (2000).Google Scholar
8. Hayes, William and Loudon, Rodney, Scattering of light by crystals, John Wiley and Sons, Inc., New York, 1978.Google Scholar
9. Mangelinck, D., Dai, J.Y., Pan, J.S. and Lahiri, S.K., Appl. Phys. Lett., 75 1736 (1999).Google Scholar
10. Burns, G. and Scott, B. A., Phys. Rev. Lett., 25 (17), 1191 (1970).Google Scholar
11. Chen, W.J. and Chen, L.J., J. Appl. Phys., 71 (2), 653 (1992).Google Scholar